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Sputtering Technology
Everything about ito sputtering target
Definition The full name of ITO is indium tin oxide, a composition of indium, tin and oxygen with different proportions. The substance of ITO and ITO sputtering target is the same, the latter of which is actually a black-gray ceramic semiconductor formed by mixing indium oxide and tin oxide powder in a certain ratio. How...
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different target shapes
Almost all new sputter deposition equipment uses a powerful magnet to spiral the electrons to accelerate the ionization of the argon around the target, resulting in an increased probability of collision between the sputtering target and the argon ions, and thus the sputtering rate is increased. Generally, most metal films uses DC sputtering, while non-conductive...
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Previously, we have introduced Four main molding methods for ITO targets, mainly about their definitions and characteristics. And today I think it necessary to talk about the advantages and disadvantages of each method, which is helpful for you to make choices between them when you want to prepare ITO targets. Hot Pressing The hot pressing...
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Zn powder
How to use ZnO or Zn powder to make large diameter sputtering target? If you want to make a sputtering target by using ZnO or Zn powder, you have to know the following points. How to make a sputtering target? There are two main ways to make a sputtering target. One is casting. The alloy...
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magnetron sputtering
Magnetron sputtering is a kind of physical vapor deposition (PVD) technology. The general sputtering method can be used to prepare a plurality of materials such as metal, semiconductor, insulator, etc., and has the advantages of simple equipment, easy control, large coating area, and strong adhesion. Magnetron sputtering has been developed since the 1970s. In addition...
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physical vapor deposition PVD
Physical vapor deposition (PVD) is a widely used thin film fabrication technique. When it comes to this phrase, many people compare it to chemical vapor deposition (CVD). Although the two phrases literally differ by only one word, the difference between them is actually great. Physical vapor deposition uses physical methods, that is, the transformation of...
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Through Silicon Via (TSV)
Copper plating is one of the most widely used pre-plated layers in the electroplating industry, including solder joints, lead-tin alloys, and zinc die-casting parts. Two important applications for copper plating are on TSV and LCD panels. Through Silicon Via (TSV) One developing application for copper plating technology is through-silicon via (TSV) 3D integration. The goal...
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Radio Frequency (RF) Sputtering
Today’s article is a follow-up update of “Sputter Coating Technologies: Direct Current (DC) Sputtering“. We have already introduced DC sputtering in detail in that article, so today SAM Sputter Targets will introduce another sputter coating technology, which is called Radio Frequency (RF) sputtering. RF sputtering uses alternate current (AC) power instead of DC power to...
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tantalum
Since tantalum has the ability to form oxides thin film, which has a protective effect, it is widely used as a base material for electrolytic capacitor manufacturing. Next, SAM Sputter Target will introduce the application of tantalum targets in the field of microelectronics. Thermal inkjet print head Thermal inkjet print heads can be used in...
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Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials.