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Sputtering Technology
advantages-and-disadvantages-of-ion-beam-sputtering
Ion Beam Sputtering Definition Ion beam sputtering (IBS), or ion beam deposition (IBD), is a thin film deposition technology that uses an ion source to deposit a sputtering target onto a substrate to produce the highest quality films with excellent precision. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control...
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an-overview-of-sputtering-deposition
Definition What is Sputtering Deposition? Sputtering deposition, or sputter coating, is one of the physical vapor deposition technology, whereby particles are ejected from a solid target material due to bombardment of the target by energetic particles. It is an electronic process that deposits thin films of metals or other materials onto a variety of surfaces. Most often,...
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3 Factors Affecting the Deposition Rate in Magnetron Sputtering
Magnetron sputtering is a physical vapor deposition method that allows the deposition of various materials, including metals, oxides, ceramics and etc. by using a specially formed magnetic field applied to a diode sputtering target. The deposition rate, or the film formation rate, is an important parameter that measures the effectiveness of the magnetron sputtering machine....
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Advantages of Physical Vapor Deposition
At present, physical vapor deposition (PVD) is a very popular coating technique in some areas, such as the watch, jewelry, car, and so on. Why are these industries so fond of PVD coatings? Let’s see the advantages of PVD coating. First of all, we have to know what physical vapor deposition is. When it comes to this...
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An Overview of Magnetron Sputtering Magnetron sputtering, a physical vapor deposition (PVD) process, is the main thin film deposition method for manufacturing semiconductor, disk drive, CD and optical devices. Magnetron sputtering has evolved since the 1970s, which has the advantages of high speed, low temperature and low damage. Definition Sputter deposition is the process whereby...
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PVD High Vacuum Coating Machines
The structure of high vacuum coating machine Vacuum body – vacuum chamber According to the different requirements of the processed products, the size of the vacuum chamber is different. The most widely used chamber diameters are 1.3m, 0.9m, 1.5m, 1.8m, etc. The chamber cavity is made of stainless steel, which is hard and rustless. Each...
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sputtering-target-purity
Effect of Sputtering Target Purity on Large-Area Coating Production The requirement of the target quality for sputter coating is higher than that of the traditional materials industry. When the substrate enters the high vacuum coating chamber, if the sputtering target is not pure enough, under the action of the electric field and the magnetic field,...
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dual-co-rf-magnetron-sputtering4
Scandium nitride (ScN) is a metal nitride semiconductor. The crystal structure of ScN is generally rock salt and non-polar. However, the first principle calculation indicates that ScN may also have wurtzite structure and can be made into Sc-IIIA-Nitride. The IIIA nitride refers to AlN, GaN and InN, and the structure of the nitride is a...
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titanium-dioxide
Titanium dioxide is a hard and chemically resistant oxide of titanium. TiO2 thin films have been widely used in various applications due to their multiple interesting properties. It has a high refractive index, which makes it attractive for the glass coating industry to produce low emissivity and antireflective coatings. It is interesting in microelectronics because...
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