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Sputtering Technology
How to Solve Common Problems in Magnetron Sputtering
Magnetron sputtering, a physical vapor deposition (PVD) process, is the main thin film deposition method for manufacturing semiconductor, disk drive, CD and optical devices. The following are common problems in magnetron sputtering. We have listed possible causes and related solutions for your information. Problem 1: The film is dark or black (1) The degree of vacuum...
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Major Problems and Answers in Coating Technology
1. What kind of coating technology can be divided into? (1) Vacuum coating (2) Electroplating (3) Chemical reaction (4) Heat treatment (5) Physical or mechanical treatment 2. What are the applications of plasma technology in surface technology? Sputter deposition: Sputtering is the use of high-speed ions to strike a solid sputter target, causing surface molecules...
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Study on the Influence of Sputtering Targets on Sputter Coatings
AlxCr1-xN coatings have excellent mechanical properties and oxidation resistance and are therefore of high application value in a variety of industrial applications. In recent years, the effects of various deposition parameters (such as partial pressure, gas mixture or temperature) on the sputtering process have been studied, but there has been little research on the influence...
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Effect of Silver Additives on the Conductivity of Indium Tin Oxide Sputtered Films
Transparent conductive films have many applications, and indium tin oxide films have received great attention in the glass manufacturing industry due to their excellent properties. However, the manufacturing process of the indium tin oxide film requires a higher temperature, which limits its application. In order to reduce this temperature, various “sintering agents” have been taken...
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What is Physical Vapor Deposition
What is PVD Coating Technology? Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules or partially ionized into ions under vacuum conditions. Then, a film having a specific function is deposited on the surface of the substrate by...
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Unbalanced magnetron sputtering Unbalanced magnetron sputtering uses unbalanced magnetron sputtering cathode, which refers to the unequal magnetic fluxes of the inner and outer magnetic pole sections of the cathode. The effect of the unbalanced magnetic field is to trap fast moving secondary electrons that escape from the target surface. These electrons undergo ionizing collisions with...
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advantages-and-disadvantages-of-ion-beam-sputtering
Ion Beam Sputtering Definition Ion beam sputtering (IBS), or ion beam deposition (IBD), is a thin film deposition technology that uses an ion source to deposit a sputtering target onto a substrate to produce the highest quality films with excellent precision. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control...
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an-overview-of-sputtering-deposition
Definition What is Sputtering Deposition? Sputtering deposition, or sputter coating, is one of the physical vapor deposition technology, whereby particles are ejected from a solid target material due to bombardment of the target by energetic particles. It is an electronic process that deposits thin films of metals or other materials onto a variety of surfaces. Most often,...
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3 Factors Affecting the Deposition Rate in Magnetron Sputtering
Magnetron sputtering is a physical vapor deposition method that allows the deposition of various materials, including metals, oxides, ceramics and etc. by using a specially formed magnetic field applied to a diode sputtering target. The deposition rate, or the film formation rate, is an important parameter that measures the effectiveness of the magnetron sputtering machine....
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