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sputtering technology
magnetron sputtering
Magnetron sputtering is a kind of physical vapor deposition (PVD) technology. The general sputtering method can be used to prepare a plurality of materials such as metal, semiconductor, insulator, etc., and has the advantages of simple equipment, easy control, large coating area, and strong adhesion. Magnetron sputtering has been developed since the 1970s. In addition...
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physical vapor deposition PVD
Physical vapor deposition (PVD) is a widely used thin film fabrication technique. When it comes to this phrase, many people compare it to chemical vapor deposition (CVD). Although the two phrases literally differ by only one word, the difference between them is actually great. Physical vapor deposition uses physical methods, that is, the transformation of...
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Through Silicon Via (TSV)
Copper plating is one of the most widely used pre-plated layers in the electroplating industry, including solder joints, lead-tin alloys, and zinc die-casting parts. Two important applications for copper plating are on TSV and LCD panels. Through Silicon Via (TSV) One developing application for copper plating technology is through-silicon via (TSV) 3D integration. The goal...
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Radio Frequency (RF) Sputtering
Today’s article is a follow-up update of “Sputter Coating Technologies: Direct Current (DC) Sputtering“. We have already introduced DC sputtering in detail in that article, so today SAM Sputter Targets will introduce another sputter coating technology, which is called Radio Frequency (RF) sputtering. RF sputtering uses alternate current (AC) power instead of DC power to...
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DC power supply
We have previously made a brief introduction of Five Sputter Coating Technologies, including unbalanced magnetron sputtering, radio frequency (RF) sputtering, direct current (DC) magnetron sputtering, mid-frequency alternating current (AC) magnetron sputtering and reactive magnetron sputtering. And today, we are going to talk about direct current (DC) sputtering in details. To begin with, let’s see the...
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sputter target
Preparation It is very important to keep the vacuum chamber clean. Some residues formed during use will collect moisture and other pollutants, directly affecting the success rate of vacuum coating. Short-circuit or target arcing, film-forming surface roughness, and chemical impurities are often exceeded due to unclean sputtering chambers, sputter guns, and targets. In order to...
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magnetron sputtering
Target magnetic field The cathode operating voltage of magnetron sputtering decreases as the target surface magnetic field increases, and also decreases as the sputtering etch groove of the target surface deepens. The sputtering current increases as the sputter etch bath of the target surface deepens because the sputter etched surface of the target gets closer...
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Ion beam sputtering is a thin film process technology that uses an ion source to sputter a target onto a substrate. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control the thickness of the substrate. Its main advantages and disadvantages are as follows: Advantages Sputter coating utilizes momentum exchange...
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sputter coating
Unbalanced magnetron sputtering If the magnetic fluxes of the inner and outer magnetic pole sections of the cathode by magnetron sputtering are not equal, it is called an unbalanced magnetron sputtering cathode. The magnetic field of the common magnetron sputtering cathode is concentrated near the target surface; the magnetic field of the unbalanced magnetron sputtering...
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