Shape:Discs, Plates, Column Targets, Step Targets, Custom-made
Indium Bonding and Elastomeric Target Bonding Service are available for Platinum (Pt) Sputtering Target. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.
|Melting Point (°C)||1,772|
|Coefficient of Thermal Expansion||8.8 x 10-6/K|
|Theoretical Density (g/cc)||21.45|
|Type of Bond||Indium, Elastomer|
|Comments||Alloys with metals. Films soft, poor adhesion. Temperatures required to achieve deposition may not be practical for thermal evaporation.|
Reclaim service is accessible for this material. We aim to reduce your material costs by recycling precious metals, spent targets, etc.
Platinum is a chemical element originated from the Spanish ‘platina’, meaning little silver. It was first mentioned in 1735 and observed by A. de Ulloa. The isolation was later accomplished and announced by A. de Ulloa. “Pt” is the canonical chemical symbol of platinum. Its atomic number in the periodic table of elements is 78 with location at Period 6 and Group 10, belonging to the d-block. The relative atomic mass of platinum is 195.084(9) Dalton, the number in the brackets indicating the uncertainty
Our Platinum (Pt) Sputtering Target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
SAM specializes in producing high purity Platinum (Pt) Sputtering Target with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.