Indium is a soft metal with a low melting point and excellent thermal and electrical properties, which make it the preferred method for bonding sputtering targets.
– Indium has the best thermal conductivity
– Indium bonding is one of the most efficient target bonding services at drawing heat away from the target.
– Indium is more malleable than other bonding solders.
– It reduces cracking that is caused by the mismatch in the thermal expansion coefficients of the target and backing plate
|Maximum Operating Temperature (°C)||150° C|
|Thermal Conductivity (W/mK)||83|
|Coefficient of Thermal Expansion (K-1)||32.1 x 10-6|
|Electrical Resistivity (ohm-cm)||8 x 10-6|
|Bond Line Thickness||0.010″ ± 0.003″|
|Target Size||Target Material||Part No.|
|1″ to 2″ Diameter||Metal or Ceramic||EJBONDMET1|
|3″ to 4″ Diameter||Metal or Ceramic||EJBONDMET3|
|5″ to 6″ Diameter||Metal or Ceramic||EJBONDMET5|
|7″ to 8″ Diameter||Metal or Ceramic||EJBONDMET7|