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(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

Category

Indium Target Bonding Service

Indium Properties

Indium is a soft metal with a low melting point and excellent thermal and electrical properties, which make it the preferred method for bonding sputtering targets.

Indium Bonding

Indium Bonding Advantages

– Indium has the best thermal conductivity

– Indium bonding is one of the most efficient target bonding services at drawing heat away from the target.

– Indium is more malleable than other bonding solders.

– It reduces cracking that is caused by the mismatch in the thermal expansion coefficients of the target and backing plate

Specification Table

Maximum Operating Temperature (°C) 150° C
Thermal Conductivity (W/mK) 83
Coefficient of Thermal Expansion (K-1) 32.1 x 10-6
Electrical Resistivity (ohm-cm) 8 x 10-6
Bond Coverage >95%
Bond Line Thickness 0.010″ ± 0.003″

Ordering Table

Target Size Target Material Part No.
1″ to 2″ Diameter Metal or Ceramic EJBONDMET1
3″ to 4″ Diameter Metal or Ceramic EJBONDMET3
5″ to 6″ Diameter Metal or Ceramic EJBONDMET5
7″ to 8″ Diameter Metal or Ceramic EJBONDMET7