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(949) 407-8904 Mon - Fri 09:00 - 18:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 09:00 - 18:00 23661 Birtcher Dr., Lake Forest, California, USA

Category

Indium Target Bonding Service

Indium Properties

Indium is a soft metal with a low melting point and excellent thermal and electrical properties, which make it the preferred method for bonding sputtering targets. Indium bonding is one of the most efficient target bonding services at drawing heat away from the target.

Indium Bonding

Indium is more malleable than other bonding solders. This reduces cracking that is caused by the mismatch in the thermal expansion coefficients of the target and backing plate.

Indium Bonding Advantages

– the best thermal conductivity

– the most efficient at drawing heat away from the target

– more malleable than other bonding solders

– reduces cracking that is caused by mismatch in the thermal expansion coefficients of the target and backing plate

– creep and remove stress as dissimilar materials cool

Specification Table

Maximum Operating Temperature (°C) 150° C
Thermal Conductivity (W/mK) 83
Coefficient of Thermal Expansion (K-1) 32.1 x 10-6
Electrical Resistivity (ohm-cm) 8 x 10-6
Bond Coverage >95%
Bond Line Thickness 0.010″ ± 0.003″

Ordering Table

Target
Size
Target
Material
PartNo
Target
Size
Target
Material
PartNo
1″ to 2″ Diameter
Metal or Ceramic
EJBONDMET1
3″ to 4″ Diameter
Metal or Ceramic
EJBONDMET3
5″ to 6″ Diameter
Metal or Ceramic
EJBONDMET5
7″ to 8″ Diameter
Metal or Ceramic
EJBONDMET7

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