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Indium is the preferred method for bonding sputtering targets because it has the best thermal conductivity of all available bonds and is the most efficient at drawing heat away from the target. Indium is also more malleable than other bonding solders and therefore it is more forgiving. The softer solder allows some “give” when the target expands at a different rate than the backing plate. This reduces cracking that is caused by mismatch in the thermal expansion coefficients of the target and backing plate. The main limitation of the indium bond is the melting temperature of the indium solder. Indium has a melting point of 156.6°C so temperatures in excess of 150°C will cause the bond to melt and fail. Most materials can be indium bonded but there are a few exceptions.

Specifications Table

Maximum Operating Temperature (°C) 150° C
Thermal Conductivity (W/mK) 83
Coefficient of Thermal Expansion (K-1) 32.1 x 10-6
Electrical Resistivity (ohm-cm) 8 x 10-6
Bond Coverage >95%
Bond Line Thickness 0.010″ ± 0.003″

Ordering Table

Target
Size
Target
Material
PartNo Price Add To
Cart
Target
Size
Target
Material
PartNo Price Add To
Cart
1″ to 2″ Diameter
Metal or Ceramic
EJBONDMET1 $220.00
3″ to 4″ Diameter
Metal or Ceramic
EJBONDMET3 $380.00
5″ to 6″ Diameter
Metal or Ceramic
EJBONDMET5 $470.00
7″ to 8″ Diameter
Metal or Ceramic
EJBONDMET7 $580.00