Metal sputtering targets are usually made from highly pure metals. They are the most widely used and fundamental coating materials for other sputter deposition technology.
Alloy sputtering targets are materials composed of one metal and other metals or non-metals while still showing the some metallic characteristics.
Common oxide ceramics sputtering targets of this type involve aluminum oxide (Al2O3), magnesium oxide (MgO), beryllium oxide (BeO), zirconium oxide (ZrO2).
Silicon nitrides (Si3N4) feature an excellent combination of material properties. They are nearly as light as silicon carbide (SiC).
Stanford Advanced Materials manufactures & supplies silicide Ceramic sputtering materials in various sizes and shapes.
Stanford Advanced Materials (SAM) supplies evaporation materials of fluoride ceramic in various sizes and shapes.
Carbide ceramics are extremely resistant to high temperature, abrasion, and corrosion. They have a high thermal and variable electrical conductivity.
Sulfide ceramic sputtering targets are used in the semiconductor industry to make thin film deposition from different materials for processing of integrated circuits.
Boride Ceramic sputtering target for polishing carbide and hardened mold surfaces. Perfect for polishing ribs, slots and sidewalls.
SAM offers selenide-ceramic sputtering target with 99.9%, 99.95%, 99.99%, 99.995%, 99.999% purity in various shapes & sizes for thin-film coating.
SAM can customize telluride ceramic targets with specific chemical compositions and geometric sizes.
In most of cases, people use relative purity such as REO(Rare earth oxide) and REM(Rare Earth Metal) to represent the purity for rare earth elements.