Chemical Formula: SiO2
Catalog Number: ST0185
CAS Number: 7631-86-9
Purity: 99.9%, 99.95%, 99.99%, 99.995%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Indium Bonding and Elastomeric Target Bonding Service are available for Silicon Dioxide (SiO2) Sputtering Target. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.
| Material Type | Silicon (IV) Oxide |
| Symbol | SiO2 |
| Color/Appearance | White, Crystalline Solid |
| Melting Point (°C) | 1,610 |
| Boiling Point (°C) | 2,230 |
| Density (kg/m-3) | 2,533 |
| Sputter | RF |
| Type of Bond | Indium, Elastomer |
| Comments | Quartz excellent in E-beam. |
| Material | Size |
| Silicon Dioxide, SiO2 | 1.00″ Dia. x 0.125″ Thick |
| Silicon Dioxide, SiO2 | 1.00″ Dia. x 0.250″ Thick |
| Silicon Dioxide, SiO2 | 2.00″ Dia. x 0.125″ Thick |
| Silicon Dioxide, SiO2 | 2.00″ Dia. x 0.250″ Thick |
| Silicon Dioxide, SiO2 | 3.00″ Dia. x 0.125″ Thick |
| Silicon Dioxide, SiO2 | 3.00″ Dia. x 0.250″ Thick |
| Silicon Dioxide, SiO2 | 4.00″ Dia. x 0.125″ Thick |
| Silicon Dioxide, SiO2 | 4.00″ Dia. x 0.250″ Thick |
| Silicon Dioxide, SiO2 | 6.00″ Dia. x 0.250″ Thick |
| Silicon Dioxide, SiO2 | 8.00″ Dia. x 0.250″ Thick |
We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.
Silicon is a chemical element originated from the Latin ‘silex’ or ‘silicis’, meaning flint. It was first mentioned in 1824 and observed by J. Berzelius. The isolation was later accomplished and announced by J. Berzelius. “Si” is the canonical chemical symbol of silicon. Its atomic number in the periodic table of elements is 14 with location at Period 3 and Group 14, belonging to the p-block. The relative atomic mass of silicon is 28.0855(3) Dalton, the number in the brackets indicating the uncertainty.
Oxygen is a chemical element originated from the Greek ‘oxy’ and ‘genes’ meaning acid-forming. It was first mentioned in 1771 and observed by W. Scheele. The isolation was later accomplished and announced by W. Scheele. “O” is the canonical chemical symbol of oxygen. Its atomic number in the periodic table of elements is 8 with location at Period 2 and Group 16, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, the number in the brackets indicating the uncertainty.
Our silicon oxide sputtering target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
SAM’s silicon oxide sputtering targets are available in various forms, purities, sizes, and prices. We specialize in producing high purity film coating materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.
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I needed sputtering targets for a experiment project, and these little guys did not disappoint me. Satisfied with SAM's products.
