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Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. We update every week about news and knowledge of sputtering targets and evaporation materials. Here are the blogs we published previously.

how to clean deposition materials shipped in oil

How to Clean Deposition Materials Shipped in Oil?

In order to protect some deposited materials from reacting with air or water vapor, they are usually immersed in low-viscosity (hydrocarbon) mineral oil during storage and shipment. Before installing these composition materials shipped in oil into the vacuum system, we must use solvents to remove these oils. The choice of solvents is based on the premise...
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How to Solve Common Problems in Magnetron Sputtering

How to Solve Common Problems in Magnetron Sputtering?

Magnetron sputtering, a physical vapor deposition (PVD) process, is the main thin film deposition method for manufacturing semiconductor, disk drive, CD and optical devices. The following are common problems in magnetron sputtering. We have listed possible causes and related solutions for your information. Here is a quick look that may save your time. Problem 1: The...
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Major Problems and Answers in Coating Technology

Major Problems and Answers in Coating Technology

1. What types of coating technology can be divided into? (1) Vacuum coating (2) Electroplating (3) Chemical reaction (4) Heat treatment (5) Physical or mechanical treatment 2. What are the applications of plasma technology in surface technology? Sputter deposition: Sputtering is the use of high-speed ions to strike a solid sputter target, causing surface molecules...
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Does Titanium Never Corrode_

Does Titanium Never Corrode?

Titanium can be alloyed with iron, aluminum, vanadium, and molybdenum to produce strong, lightweight alloys for aerospace (jet engines, missiles, and spacecraft), military, industrial processes (chemicals and petrochemicals, desalination plants, pulp, and paper), automotive, marine, human implants, and other applications. In addition to low density and high specific strength, another important advantage of titanium alloy...
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electron beam evaporation

An Overview of Electron Beam Evaporation

Electron Beam Evaporation – Definition Electron beam evaporation, or E-beam evaporation, is a type of physical vapor deposition (PVD) technique, which directly heats the evaporation material (usually pellets) by using an electron beam under vacuum, and transports the vaporized material to the substrate to form a film. Electron Beam Evaporation – Working Processes Electron beam evaporation...
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PVD VS. CVD

Table Comparison: Physical Vapor Deposition Vs. Chemical Vapor Deposition

Physical vapor deposition (PVD) and chemical vapor deposition (CVD) are considered to be the most attractive surface coating technologies and have a wide range of applications in various industries. Let us compare these two methods in detail. Physical Vapor Deposition Chemical Vapor Deposition Definition Physical vapor deposition (PVD) is a series of vacuum deposition methods...
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Platinum vs. Gold Ring

Platinum vs. Gold: Which Material Is Better for Rings?

As for the two most commonly used metals for engagement and wedding rings, platinum and gold, most people distinguish them by their different colors-platinum is naturally white, and gold is naturally yellow. However, rings made of white gold (composed of gold, alloys, and a rhodium plating) have a similar white color to platinum rings. Since...
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How is the Semiconductor Wafer Manufactured? (With Infographic)

Semiconductor wafers are the basic material for manufacturing electronic chips. The most important raw material for semiconductor integrated circuits is silicon, which is widely found in rocks and gravels in the form of silicates or silica in nature. The fabrication process of the semiconductor silicon wafer can be divided into three basic steps: silicon purification...
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What Are the Applications of Sputtering Targets? (With Video)

Sputtering targets are a physical vapor deposition (PVD) mechanism with many uses in modern technology and manufacturing. In the sputtering process, the atoms are pulled from the sputter target with powerful magnets, and a controlled gas (usually argon) is introduced. Then, the processed to collide with each other in their gaseous state before condensing into...
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