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Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. We update every week about news and knowledge of sputtering targets and evaporation materials. Here are the blogs we published previously.

An Overview of Magnetron Sputtering

An Overview of Magnetron Sputtering Magnetron sputtering, a physical vapor deposition (PVD) process, is a main thin film deposition method for manufacturing semiconductors, disk drives, CDs, and optical devices. Magnetron sputtering has the advantages of high speed, low temperature, and low damage. In this article, let’s take a look at the definition, working principle, and...
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What is Chemical Vapor Deposition (CVD)? The Ultimate Guide

Introduction Chemical Vapor Deposition (CVD) might sound like an obscure lab technique, but it’s the invisible engine behind modern technology. It’s what makes your smartphone processor faster, your new sunglasses more scratch-resistant, and a jet engine withstand infernal temperatures. In essence, CVD is the art of turning a gas into a perfect solid coating, and...
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Metal Encyclopedia Seventeen Rare Earth Elements Introduction

Metal Encyclopedia: Seventeen Rare Earth Elements Introduction

Rare-earth element is a general term for 17 elements of lanthanides as well as scandium and yttrium in the chemical periodic table. Scandium and yttrium are included in rare earth element because they are often symbiotic with lanthanide elements in mineral deposits, and thus have similar chemical properties. Rare earth materials are important for many...
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Automotive manufacturing

6 Crucial Aluminum Uses in Daily Life (And Why It’s Everywhere)

Aluminum is everywhere. Cars, foil, power lines, window frames — you name it. It’s lightweight, tough, and incredibly versatile. It makes up around 8% of the Earth’s crust, which makes it the most abundant metal out there. Pretty impressive for a material we barely notice, right? Even more impressive is that it’s 100% recyclable, making it...
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PVD VS. CVD

Table Comparison: Physical Vapor Deposition Vs. Chemical Vapor Deposition

1. The Core Difference at a Glance Before diving deep, here is the fundamental distinction: PVD (Physical Vapor Deposition): A physical process. A solid material is vaporized in a vacuum and then condenses as a thin film on the substrate. Think of it as transferring material atom-by-atom. CVD (Chemical Vapor Deposition): A chemical process. Gaseous precursors react or decompose on the...
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Everything You Need to Know About Sputtering Targets

1. Introduction to Sputtering Targets Sputtering targets are significant commodities for thin-film industries like electronics, optics, and energy sectors. Simply put, a “sputtering target” is the target material utilized for sputtering, a form of physical vapor deposition (PVD). During the PVD process, atoms from a solid target are removed and ejected upon impact by high-energy...
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What is Physical Vapor Deposition

What is Physical Vapor Deposition (PVD)?

What is PVD Coating Technology? Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules, or partially ionized into ions under vacuum conditions. Then, a film having a specific function is deposited on the surface of the substrate by...
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advantages-and-disadvantages-of-ion-beam-sputtering

Advantages and Disadvantages of Ion Beam Sputtering

Ion Beam Sputtering Definition Ion beam sputtering (IBS), or ion beam deposition (IBD), is a thin film deposition technology that uses an ion source to deposit a sputtering target onto a substrate to produce the highest quality films with excellent precision. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control...
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3 Factors Affecting the Deposition Rate in Magnetron Sputtering

3 Factors Affecting the Deposition Rate in Magnetron Sputtering

Magnetron sputtering is a physical vapor deposition method that allows the deposition of various materials, including metals, oxides, ceramics and etc., by using a specially formed magnetic field applied to a diode sputtering target. The deposition rate, or the film formation rate, is an important parameter that measures the effectiveness of the magnetron sputtering machine....
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