Chemical Formula: Al
Catalog Number: ST0001
CAS Number: 7429-90-5
Purity: 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Aluminum sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) is your one-stop source to find aluminum sputter targets for sale.
Aluminum sputtering target has the same properties as metal aluminum. Aluminum, or Aluminium, is a silvery-white, soft, non-magnetic and ductile metal in the boron group. By mass, aluminum makes up about 8% of the Earth’s crust; it is the third most abundant element after oxygen and silicon and the most abundant metal in the crust, though it is less common in the mantle below. The chief ore of aluminum is bauxite. Aluminum metal is highly reactive, such that native specimens are rare and limited to extreme reducing environments. Instead, it is found combined in over 270 different minerals. When evaporated in a vacuum, aluminum layers form a reflective coating found on telescopes, automotive headlamps, mirrors, packages, and toys. Aluminum sputter target is widely used in the aerospace, automotive lighting, OLED, and optical industries.
Related Post: An Overview of Aluminum Sputtering Target
|Type of Bond||Indium, Elastomer|
|Comments||Alloys W/Mo/Ta. Flash evap or use BN crucible|
|Available Sizes||Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″
We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.
Aluminum has good thermal properties and is malleable and ductile. Aluminum and its alloys are widely used for various applications including aircraft assemblies and engine parts. Aluminunm sputtering target is used for thin film deposition, typically for fuel cell, decoration, semiconductor, display, LED and photovoltaic devices, glass coating, etc.
Indium Bonding and Elastomeric Target Bonding Service are available for aluminum sputter target. Stanford Advanced Materials (SAM) is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.
Aluminum is obtained by extracting Al2O3 from bauxite and then electrolyzing Al2O3 in molten cryolite. The purity of aluminum obtained by this method is generally above 99%, but it is still cannot be a raw material for producing aluminum sputter targets. The first and the most important requirement of the target is high purity. The high-purity aluminum used in the aluminum targets is produced by the segregation method, three-layer electrolysis method or combined regional melting method. Thus it is much more expensive than industrial pure aluminum. SAM provides aluminum targets of high quality and at a competitive price.
As a raw material, high-purity aluminum ingot is forged, rolled, and heated, so that the crystal grains in the aluminum ingot are fined and the density is increased to meet the requirements of the Al sputter target required for sputtering. Then, the deformed high-purity aluminum material is processed into a target size required for the vacuum coater. The requirements for Al target processing are high precision and high surface quality.
Our aluminum sputter targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
SAM’s aluminum sputtering targets are available in various forms, purities, sizes, and prices. They are available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Please send us an inquiry for current pricing on sputtering targets and other deposition materials not listed.
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