Chemical Formula: Al2O3
Catalog Number: ST0129
CAS Number: 1344-28-1
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Aluminium, also called aluminum, is a chemical element originated from the Latin name for alum, ‘alumen’ meaningbitter salt. It was first mentioned in 1825 and observed by H.C.Ã˜rsted. The isolation was later accomplished and announced by H.C.Ã˜rsted. “Al” is the canonical chemical symbol of aluminium. Its atomic number in the periodic table of elements is 13 with location at Period 3 and Group 13, belonging to the p-block. The relative atomic mass of aluminium is 26.9815386(8) Dalton, the number in the brackets indicating the uncertainty. Related Product: Aluminum (Al) Sputtering Target
Oxygen is a chemical element originated from the Greek ‘oxy’ and ‘genes’ meaning acid-forming. It was first mentioned in 1771 and observed by W. Scheele. The isolation was later accomplished and announced by W. Scheele. “O” is the canonical chemical symbol of oxygen. Its atomic number in the periodic table of elements is 8 with location at Period 2 and Group 16, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, the number in the brackets indicating the uncertainty.
|Material Type||Aluminum Oxide|
|Color/Appearance||White, Crystalline Solid|
|Melting Point (°C)||2,072|
|Theoretical Density (g/cc)||3.97|
|Type of Bond||Indium|
Indium Bonding is recommended for Aluminum Oxide (Al2O3) Sputtering Target. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.
Our Aluminum Oxide (Al2O3) Sputtering Target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
SAM specializes in producing high purity Aluminum Oxide (Al2O3) Sputtering Target with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.