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(949) 407-8904 Mon - Fri 09:00 - 18:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 09:00 - 18:00 23661 Birtcher Dr., Lake Forest, California, USA

Aluminum Oxide (Al2O3) Sputtering Target

Chemical Formula: Al2O3
Catalog Number: ST0129
CAS Number: 1344-28-1
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made




Description

Target Bonding of Aluminum Oxide (Al2O3) Sputtering Target

Indium Bonding  is  recommended for Aluminum Oxide (Al2O3) Sputtering Target. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.

target bonding

Specification of Aluminum Oxide (Al2O3) Sputtering Target

Material Type Aluminum Oxide
Symbol Al2O3
Color/Appearance White, Crystalline Solid
Melting Point (°C) 2,072
Theoretical Density (g/cc) 3.97
Z Ratio 0.336
Sputter RF-R
Type of Bond Indium

Aluminum Description

AluminumAluminium, also called aluminum, is a chemical element originated from the Latin name for alum, ‘alumen’ meaningbitter salt. It was first mentioned in 1825 and observed by H.C.Ørsted. The isolation was later accomplished and announced by H.C.Ørsted. “Al” is the canonical chemical symbol of aluminium. Its atomic number in the periodic table of elements is 13 with location at Period 3 and Group 13, belonging to the p-block. The relative atomic mass of aluminium is 26.9815386(8) Dalton, the number in the brackets indicating the uncertainty. Related Product: Aluminum (Al) Sputtering Target

Oxygen Description

OxygenOxygen is a chemical element originated from the Greek ‘oxy’ and ‘genes’ meaning acid-forming. It was first mentioned in 1771 and observed by W. Scheele. The isolation was later accomplished and announced by W. Scheele. “O” is the canonical chemical symbol of oxygen. Its atomic number in the periodic table of elements is 8 with location at Period 2 and Group 16, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, the number in the brackets indicating the uncertainty.

Packaging

Our Aluminum Oxide (Al2O3) Sputtering Target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Get Contact

SAM specializes in producing high purity Aluminum Oxide (Al2O3) Sputtering Target with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.

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Aluminum Oxide (Al2O3) Sputtering Target
Average rating:  
 1 reviews
by Paul McNamara on Aluminum Oxide (Al2O3) Sputtering Target

Product delivered just as requested and easy to put together. Will buy again. Great customer service.