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How to Solve Common Problems in Magnetron Sputtering
Magnetron sputtering, a physical vapor deposition (PVD) process, is the main thin film deposition method for manufacturing semiconductor, disk drive, CD and optical devices. The following are common problems in magnetron sputtering. We have listed possible causes and related solutions for your information. Here is a quick look that may save your time. Problem 1: The...
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Major Problems and Answers in Coating Technology
1. What kind of coating technology can be divided into? (1) Vacuum coating (2) Electroplating (3) Chemical reaction (4) Heat treatment (5) Physical or mechanical treatment 2. What are the applications of plasma technology in surface technology? Sputter deposition: Sputtering is the use of high-speed ions to strike a solid sputter target, causing surface molecules...
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Does Titanium Never Corrode_
Titanium can be alloyed with iron, aluminum, vanadium, and molybdenum to produce strong, lightweight alloys for aerospace (jet engines, missiles, and spacecraft), military, industrial processes (chemicals and petrochemicals, desalination plants, pulp, and paper), automotive, marine, human implants, and other applications. In addition to low density and high specific strength, another important advantage of titanium alloy...
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electron beam evaporation
Electron Beam Evaporation – Definition Electron beam evaporation, or E-beam evaporation, is a type of physical vapor deposition (PVD) technique, which directly heats the evaporation material (usually pellets) by using an electron beam under vacuum, and transports the vaporized material to the substrate to form a film. Electron Beam Evaporation – Working Processes Electron beam evaporation...
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PVD VS. CVD
Physical vapor deposition (PVD) and chemical vapor deposition (PVD) are considered to be the most attractive surface coating technologies and have a wide range of applications in various industries. Let us compare these two methods in detail. Physical Vapor Deposition Chemical Vapor Deposition Definition Physical vapor deposition (PVD) is a series of vacuum deposition methods...
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Semiconductor wafers are the basic material for manufacturing electronic chips. The most important raw material for semiconductor integrated circuits is silicon, which is widely found in rocks and gravels in the form of silicates or silica in nature. The fabrication process of the semiconductor silicon wafer can be divided into three basic steps: silicon purification...
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Sputtering targets are a physical vapor deposition (PVD) mechanism with many uses in modern technology and manufacturing. In the sputtering process, the atoms are pulled from the sputter target with powerful magnets, and a controlled gas (usually argon) is introduced. Then, the processed to collide with each other in their gaseous state before condensing into...
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Common Defects in Physical Vapor Deposition
Due to their excellent wear resistance, heat resistance and other properties, PVD coatings are widely used in various industries. However, the defects of the coating make it impossible to demonstrate all of its advantages. If you want to solve the defects in PVD coating, you must know these defects, at least you should know – what...
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everything about titanium sputtering target
Metal titanium and titanium sputtering target are essentially the same, both of which are composed of titanium element; the difference is that metal titanium is more like a raw material, and titanium target is more like a titanium product. Titanium as a raw material can be made into titanium sputtering targets by several methods, and...
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