In order to protect some deposited materials from reacting with air or water vapor, they are usually immersed in low-viscosity (hydrocarbon) mineral oil during storage and shipment. Before installing these composition materials shipped in oil into the vacuum system, we must use solvents to remove these oils. The choice of solvents is based on the premise...Continue Reading

Magnetron sputtering, a physical vapor deposition (PVD) process, is the main thin film deposition method for manufacturing semiconductor, disk drive, CD and optical devices. The following are common problems in magnetron sputtering. We have listed possible causes and related solutions for your information. Here is a quick look that may save your time. Problem 1: The...Continue Reading

1. What types of coating technology can be divided into? (1) Vacuum coating (2) Electroplating (3) Chemical reaction (4) Heat treatment (5) Physical or mechanical treatment 2. What are the applications of plasma technology in surface technology? Sputter deposition: Sputtering is the use of high-speed ions to strike a solid sputter target, causing surface molecules...Continue Reading

Titanium can be alloyed with iron, aluminum, vanadium, and molybdenum to produce strong, lightweight alloys for aerospace (jet engines, missiles, and spacecraft), military, industrial processes (chemicals and petrochemicals, desalination plants, pulp, and paper), automotive, marine, human implants, and other applications. In addition to low density and high specific strength, another important advantage of titanium alloy...Continue Reading

Electron Beam Evaporation – Definition Electron beam evaporation, or E-beam evaporation, is a type of physical vapor deposition (PVD) technique, which directly heats the evaporation material (usually pellets) by using an electron beam under vacuum, and transports the vaporized material to the substrate to form a film. Electron Beam Evaporation – Working Processes Electron beam evaporation...Continue Reading

Physical vapor deposition (PVD) and chemical vapor deposition (CVD) are considered to be the most attractive surface coating technologies and have a wide range of applications in various industries. Let us compare these two methods in detail. Physical Vapor Deposition Chemical Vapor Deposition Definition Physical vapor deposition (PVD) is a series of vacuum deposition methods...Continue Reading

As for the two most commonly used metals for engagement and wedding rings, platinum and gold, most people distinguish them by their different colors-platinum is naturally white, and gold is naturally yellow. However, rings made of white gold (composed of gold, alloys, and a rhodium plating) have a similar white color to platinum rings. Since...Continue Reading

Semiconductor wafers are the basic material for manufacturing electronic chips. The most important raw material for semiconductor integrated circuits is silicon, which is widely found in rocks and gravels in the form of silicates or silica in nature. The fabrication process of the semiconductor silicon wafer can be divided into three basic steps: silicon purification...Continue Reading

Sputtering targets are a physical vapor deposition (PVD) mechanism with many uses in modern technology and manufacturing. In the sputtering process, the atoms are pulled from the sputter target with powerful magnets, and a controlled gas (usually argon) is introduced. Then, the processed to collide with each other in their gaseous state before condensing into...Continue Reading