Chemical Formula: BN
Catalog Number: ST0209
CAS Number: 10043-11-5
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Boron nitride sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) is experienced in providing the highest quality BN target products.
Boron nitride sputtering target from Stanford Advanced Materials contains the element of B and N. Boron nitride, with “BN” as its standard chemical symbol, is a ceramic material that has the advantages of high heat capacity, excellent thermal conductivity and low dielectric constant and excellent dielectric strength. In addition, BN materials are easy to process and non-adhesive. These characteristics make boron nitride a truly excellent ceramic material and has a wide range of applications.
|Material Type||Boron Nitride|
|Color/Appearance||White, Crystalline Solid|
|Melting Point||~3,000 °C|
|Theoretical Density||2.25 g/cc|
|Type of Bond||Indium, Elastomer|
|Comments||Decomposes when sputtered. Reactive preferred.|
|Available Sizes||Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″
We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.
Boron nitride sputtering targets are used for thin film deposition, typically for fuel cell, decoration, electrical insulator, semiconductor, display, LED and photovoltaic devices, glass coating, etc. Because of excellent thermal and chemical stability, boron nitride ceramics products are traditionally used as parts of high-temperature equipment. Boron nitride also has potential use in nanotechnology. BN nanotubes can be produced that have a structure similar to that of carbon nanotubes, i.e. graphene (or BN) sheets rolled on themselves, but the properties are very different. Hexagonal BN (h-BN) Ceramic is usually used to make BN crucible. Cubic boron nitride (c-BN) is used as an abrasive and is an ideal material for heat spreaders. Amorphous boron nitride (a-BN) Layers of amorphous boron nitride (a-BN) are used in some semiconductor devices.
Boron nitrides sputter target can be bonded by Indium Bonding and Elastomer Bonding. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.
Boron nitride sputter targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
SAM’s high quality BN sputtering target is available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Please send us an inquiry for current pricing on sputtering targets and other deposition materials not listed.
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Great stuff wish I found out about this stuff years ago.