Copper sputtering target is an excellent sputtering material in the vacuum coating industry. It is a product of high-purity copper material after a series of processes. It has specific dimensions and shapes. Since high purity copper material, especially ultra-high purity copper, has many excellent properties, copper sputter target has been widely used in cutting-edge fields such as electronics, communications, superconductivity, and aerospace.
Copper sputter target physical properties
|Purity||99.9%, 99.99%, 99.999%|
|Shape||Discs, Plates, Column Targets, Step Targets, Custom-made|
Copper sputter target application
Copper sputtering target is suitable for DC two-pole sputtering, three-pole sputtering, four-pole sputtering, radio-frequency (RF) sputtering, ion beam sputtering, magnetron sputtering, and etc. It can be used to coat reflective films, conductive films, semiconductor films, capacitor films, decorative films, protective films, integrated circuits, displays, and so on. Compared with other targets, such as titanium sputtering target, the price of copper targets is much lower. Therefore, the copper target is the preferred sputtering material under the premise of meeting the requirements of the film layer.
Copper sputter target classification
Planar copper targets are sheet-shaped, with round and square type.
The rotatory copper target is tubular, and the utilization efficiency is high. The rotary copper target product can be finally obtained through various processes such as high-purity copper extrusion, stretching, straightening, heat treatment and machining.
Copper sputter target production method
The raw material for copper smelting is copper ore, which can be divided into three categories
- Sulphide ore: chalcopyrite (CuFeS2), porphyrite (Cu5FeS4) and chalcopyrite (Cu2S).
- Oxidized ore: cupro ore (Cu2O). malachite, [Cu2(OH)2CO3], chrysocolla (CuSiO3·2H2O).
- Natural copper
Among the copper ore, the ore with a copper content of about 1% (0.5% to 3%) is worth mining. As for these ores, some impurities such as gangue can be removed by flotation, and it is easy to obtain the ore concentrate with a high copper content (8% to 35%). After extraction, crude copper is obtained, and the copper is purified from 99.95% to 99.99%, 99.999%, and 99.9999% by multiple electrolysis and regional melting methods.
Forging, rolling, and heat-treating high-purity copper ingots in raw materials, making the crystal grains in the copper ingot smaller and increasing in density to meet the requirements of copper targets required for sputtering.
After the deformation treatment, the high-purity copper material is machined to achieve high precision and high surface quality and to fit the size for the vacuum coater.
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