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Copper sputtering targets

Copper sputtering target is an excellent sputtering material in the vacuum coating industry. It is a product of high-purity copper material after a series of processes. It has specific dimensions and shapes. Since high purity copper material, especially ultra-high purity copper, has many excellent properties, copper sputter target has been widely used in cutting-edge fields such as electronics, communications, superconductivity, and aerospace.

Copper sputter target physical properties

Chemical Formula Cu
Purity 99.9%, 99.99%, 99.999%
Shape Discs, Plates, Column Targets, Step Targets, Custom-made
Color/Appearance Copper, Metallic
Density 8.92g/cm3
Melting Point 1083.4℃
Boiling Point 2567℃

Copper sputter target application

Copper sputtering target is suitable for DC two-pole sputtering, three-pole sputtering, four-pole sputtering, radio-frequency (RF) sputtering, ion beam sputtering, magnetron sputtering, and etc. It can be used to coat reflective films, conductive films, semiconductor films, capacitor films, decorative films, protective films, integrated circuits, displays, and so on. Compared with other targets, such as titanium sputtering target, the price of copper targets is much lower. Therefore, the copper target is the preferred sputtering material under the premise of meeting the requirements of the film layer.

Copper sputter target classification

Copper targets are divided into planar copper targets and rotatory copper targets.

Planar copper targets are sheet-shaped, with round and square type.

The rotatory copper target is tubular, and the utilization efficiency is high. The rotary copper target product can be finally obtained through various processes such as high-purity copper extrusion, stretching, straightening, heat treatment and machining.

rotatory copper sputtering target
rotatory copper sputtering target

Copper sputter target production method

Step 1

The raw material for copper smelting is copper ore, which can be divided into three categories

  1. Sulphide ore: chalcopyrite (CuFeS2), porphyrite (Cu5FeS4) and chalcopyrite (Cu2S).
  2. Oxidized ore: cupro ore (Cu2O). malachite, [Cu2(OH)2CO3], chrysocolla (CuSiO3·2H2O).
  3. Natural copper

Among the copper ore, the ore with a copper content of about 1% (0.5% to 3%) is worth mining. As for these ores, some impurities such as gangue can be removed by flotation, and it is easy to obtain the ore concentrate with a high copper content (8% to 35%). After extraction, crude copper is obtained, and the copper is purified from 99.95% to 99.99%, 99.999%, and 99.9999% by multiple electrolysis and regional melting methods.

Step 2

Forging, rolling, and heat-treating high-purity copper ingots in raw materials, making the crystal grains in the copper ingot smaller and increasing in density to meet the requirements of copper targets required for sputtering.

Step 3

After the deformation treatment, the high-purity copper material is machined to achieve high precision and high surface quality and to fit the size for the vacuum coater.

For more information about sputtering targets, please visit https://www.sputtertargets.net/.

About the author

Julissa Green graduated from the University of Taxes studying applied chemistry. She started her journalism life as a chemistry specialist in Stanford Advanced Materials (SAM) since 2016 and she has been fascinated by this fast growing industry ever since. If you have any particular topics of interest, or you have any questions, you can reach her at julissa@samaterials.com.

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Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials.





 

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