Chemical Formula: Cu
Catalog Number: ST0403
CAS Number: 7440-50-8
Purity: 99.9%, 99.99%, 99.999%
Thermal Conductivity: 400 W/m.K
Melting Point (°C): 1,083
Coefficient of Thermal Expansion: 16.5 x 10-6/K
Planar copper sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) is your one-stop source to find copper sputter targets for sale.
Planar copper sputtering target is a series of processed products of high-purity copper material, and it has a specific size and shape of high-purity copper material. It is used for vacuum coating.
Copper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Copper Sputter Target
|Dimension||70”||90”||1/2”||< 450 lbs|
|Melting Point||1,083 ℃|
Our planar copper sputtering target are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.
SAM specializes in producing high purity planar copper sputtering target with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.
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Used these for classroom chemical projects and experiments. Works great.