Chemical Formula: Cu
Catalog Number: ST0403
CAS Number: 7440-50-8
Purity: 99.9%, 99.99%, 99.999%
Thermal Conductivity: 400 W/m.K
Melting Point (°C): 1,083
Coefficient of Thermal Expansion: 16.5 x 10-6/K
Stanford Advanced Materials specializes in producing high purity Planar Copper sputtering targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.
| W | L | T | GW | |
| Dimension | 70” | 90” | 1/2” | < 450 lbs |
