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(949) 407-8904 Mon - Fri 09:00 - 18:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 09:00 - 18:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0011 Copper Sputtering Target, Cu

Chemical Formula: Cu
Catalog Number: ST0011
CAS Number: 7440-50-8
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Copper sputtering target Safety Data Sheet

 




Description

Description

CopperCopper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.

Specifications

Material Type Copper
Symbol Cu
Color/Appearance Copper, Metallic
Melting Point 1,083 ℃
Density 8.96 g/cm3
Sputter DC
Type of Bond Indium, Elastomer
Comments Adhesion poor. Use interlayer (Cr). Evaporates using any source material.
Available Sizes Target dimensions: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thickness: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.

Planar and Rotary Copper Sputtering Target

Our planar copper sputter targets have high purity & density and uniform microstructure that can be perfectly applied in depositing thin films in TFT displays and other related industries. Both of single and multi-piece molybdenum planar targets are available.

Our rotatory copper sputter targets have a high utilization rate of more than 75% that ensures you make full use of the target materials.

planar and rotory copper sputtering target

Target Bonding

Indium Bonding and Elastomeric Target Bonding Service are available for the Cu sputtering target. Stanford Advanced Materials (SAM) is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.

Target Bonding Services

 

Applications

Sputtering is a process whereby atoms are ejected from a solid target material due to the bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition. The Cu sputter target is used for CD-ROM, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Packing

Our copper sputter targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Get Contact

SAM’s copper sputter targets are available in various forms, purities, sizes, and prices. All the sputtering target can be designed for customized uses. We also supply rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes. Get an inquiry right now.

 

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Copper (Cu) Sputtering Target
Average rating:  
 1 reviews
by Carol Anderson on Copper (Cu) Sputtering Target

I bought these for chemistry class to do some film coating experiments with. They function properly for what we use them for.