Chemical Formula: Cu
Catalog Number: ST0011
CAS Number: 7440-50-8
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Our planar copper sputtering targets have high purity & density and uniform microstructure that can be perfectly applied in depositing thin films in TFT displays and other related industries. Both of single and multi-piece molybdenum planar targets are available.
Our rotatory copper sputtering targets have a high utilization rate of more than 75% that ensure you make full use of the target materials.
Indium Bonding and Elastomeric Target Bonding Service are available for copper sputtering target. Stanford Advanced Materials (SAM) is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.
|Melting Point||1,083 ℃|
|Type of Bond||Indium, Elastomer|
|Comments||Adhesion poor. Use interlayer (Cr). Evaporates using any source material.|
|Copper, Cu||1.00″ Dia. x 0.125″ Thick|
|Copper, Cu||1.00″ Dia. x 0.250″ Thick|
|Copper, Cu||2.00″ Dia. x 0.125″ Thick|
|Copper, Cu||2.00″ Dia. x 0.250″ Thick|
|Copper, Cu||3.00″ Dia. x 0.125″ Thick|
|Copper, Cu||3.00″ Dia. x 0.250″ Thick|
|Copper, Cu||4.00″ Dia. x 0.125″ Thick|
|Copper, Cu||4.00″ Dia. x 0.250″ Thick|
|Copper, Cu||6.00″ Dia. x 0.250″ Thick|
|Copper, Cu||8.00″ Dia. x 0.250″ Thick|
We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.
Copper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.
Sputtering is a process whereby atoms are ejected from a solid target material due to the bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition. Copper sputtering target is used for CD-ROM, decoration, flat panel displays, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.
Our copper sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
SAM’s copper sputter targets are available in various forms, purities, sizes, and prices. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.
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I bought these for chemistry class to do some film coating experiments with. They function properly for what we use them for.