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Sputtering Target
Study on the Influence of Sputtering Targets on Sputter Coatings
AlxCr1-xN coatings have excellent mechanical properties and oxidation resistance and are therefore of high application value in a variety of industrial applications. In recent years, the effects of various deposition parameters (such as partial pressure, gas mixture or temperature) on the sputtering process have been studied, but there has been little research on the influence...
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tantalum target semiconductor
Element Overview The texture of the tantalum is very hard and the hardness can reach 6-6.5. Its melting point is as high as 2996 ° C, only after carbon, tungsten, rhenium and osmium. Tantalum is malleable and can be drawn into a thin foil. Its coefficient of thermal expansion is very small, and it only expands by 6.6...
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sputtering target for electronics
Sputtering targets have important applications in many areas, such as architecture, optics, electronics and so on. Sputtering targets used in electronic industry can be subdivided into semiconductor target (also called anelva target), planar target, coated glass target, solar photovoltaic target, and so on. There are some differences in the selection and performance requirements of sputtering materials in different application fields....
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Sputtering targets are a physical vapor deposition (PVD) mechanism with many uses in modern technology and manufacturing. In the sputtering process, the atoms are pulled from the sputter target with powerful magnets, and a controlled gas (usually argon) is introduced. Then, the processed to collide with each other in their gaseous state before condensing into...
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everything about titanium sputtering target
Metal titanium and titanium sputtering target are essentially the same, both of which are composed of titanium element; the difference is that metal titanium is more like a raw material, and titanium target is more like a titanium product. Titanium as a raw material can be made into titanium sputtering targets by several methods, and...
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The sputtering target is an important material for physical vapor deposition, the most widely used technology for depositing materials. As its name suggests, “physical” means that the PVD coating method involves a purely physical process. During the physical vapor deposition, a solid target material is broken up into the vapor state (usually in a high...
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3 Factors Affecting the Deposition Rate in Magnetron Sputtering
Magnetron sputtering is a physical vapor deposition method that allows the deposition of various materials, including metals, oxides, ceramics and etc. by using a specially formed magnetic field applied to a diode sputtering target. The deposition rate, or the film formation rate, is an important parameter that measures the effectiveness of the magnetron sputtering machine....
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The yttrium oxide dielectric film refers to a thin film material as a dielectric, which is an important component and ideal material of a hybrid integrated circuit used in the electronics industry. Yttrium Oxide Dielectric Film Properties Y2O3 is a white powder with a crystal structure of body-centered cubic. Yttrium Oxide Dielectric Film has good...
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Advantages of Physical Vapor Deposition
At present, physical vapor deposition (PVD) is a very popular coating technique in some areas, such as the watch, jewelry, car, and so on. Why are these industries so fond of PVD coatings? Let’s see the advantages of PVD coating. First of all, we have to know what physical vapor deposition is. When it comes to this...
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