Chemical Formula: Cu
Catalog Number: ST0400
CAS Number: 7440-50-8
Purity: 99.9%, 99.99%, 99.999%
Thermal Conductivity: 400 W/m.K
Melting Point (°C): 1,083
Coefficient of Thermal Expansion: 16.5 x 10-6/K
Comparing with planar targets, rotatory target contains more material and offers a greater utilization, which means longer production runs and reduced downtime of the system, increases the throughput of the coating equipment. Besides, rotary sputter target allows the use of higher power densities due to the heat build-up being spread evenly over the surface area of the target. As a consequence, an increased deposition speed can be seen along with an improved performance during reactive sputtering.