All for Joomla All for Webmasters
(949) 407-8904 Mon - Fri 09:00 - 18:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 09:00 - 18:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0400 Rotatory Copper (Cu) Sputtering Target

Chemical Formula: Cu
Catalog Number: ST0400
CAS Number: 7440-50-8
Purity: 99.9%, 99.99%, 99.999%
Thermal Conductivity: 400 W/m.K
Melting Point (°C): 1,083
Coefficient of Thermal Expansion: 16.5 x 10-6/K




Description

Comparing with planar targets, rotatory target contains more material and offers a greater utilization, which means longer production runs and reduced downtime of the system, increases the throughput of the coating equipment. Besides, rotary sputter target allows the use of higher power densities due to the heat build-up being spread evenly over the surface area of the target. As a consequence, an increased deposition speed can be seen along with an improved performance during reactive sputtering.

OD ID L
Dimension 5.5”-7” 5”-5.5” <138”
Submit your review
1
2
3
4
5
Submit
     
Cancel

Create your own review

Rotatory Copper (Cu) Sputtering Target
Average rating:  
 2 reviews
by Jessica Woods on Rotatory Copper (Cu) Sputtering Target
Worked great!

I used it for semiconductor coating and it worked well. I have to admit that rotary target really has higher use ratio.

by Smagul Karazhanov on Rotatory Copper (Cu) Sputtering Target

Good product. Excellent price. Quick Shipment.