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(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0400 Rotatory Copper (Cu) Sputtering Target

Chemical Formula: Cu
Catalog Number: ST0400
CAS Number: 7440-50-8
Purity: 99.9%, 99.99%, 99.999%
Thermal Conductivity: 400 W/m.K
Melting Point (°C): 1,083
Coefficient of Thermal Expansion: 16.5 x 10-6/K

Rotatory copper sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) is your one-stop source to find copper sputter targets for sale.


Rotatory Copper Sputtering Target Description

Rotatory copper sputtering target is a series of processed products of high-purity copper material, and it has a specific size and shape of high-purity copper material. It is used for vacuum coating.

CopperCopper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.

Related Post: Copper Sputter Target: An Excellent Sputtering Material

Rotatory Copper Sputtering Target Specification

Dimension 5.5”-7” 5”-5.5” <138”

Material Type Copper
Symbol Cu
Color/Appearance Copper, Metallic
Melting Point 1,083 ℃
Density 8.96 g/cm3

Rotatory Target VS. Planar Target

Comparing with planar targets, rotatory target contains more material and offers a greater utilization, which means longer production runs and reduced downtime of the system, increases the throughput of the coating equipment. Besides, rotary sputter target allows the use of higher power densities due to the heat build-up being spread evenly over the surface area of the target. As a consequence, an increased deposition speed can be seen along with an improved performance during reactive sputtering.


Our rotatory copper sputtering target are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.

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SAM specializes in producing high purity rotatory copper sputtering target with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.

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Rotatory Copper (Cu) Sputtering Target
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 2 reviews
by Jessica Woods on Rotatory Copper (Cu) Sputtering Target

I used it for semiconductor coating and it worked well. I have to admit that rotary target really has higher use ratio.

by Smagul Karazhanov on Rotatory Copper (Cu) Sputtering Target

Good product. Excellent price. Quick Shipment.