Company Dynamic

Titanium is a widely used material in thin film technology due to its high strength, corrosion resistance, and compatibility with a broad range of substrates. In sputtering, titanium targets are applied to deposit thin metallic films directly, or to form compound films such as titanium nitride (TiN) and titanium dioxide (TiO₂). These coatings are valued...Continue Reading

Introduction Thin film deposition is an integral part of semiconductor chip production. Sputtering is perhaps the most established and reliable method of placing smooth films on wafers. Among all the materials that have been employed as targets, niobium stands out for its unique combination of electrical, thermal, and chemical properties that qualify it perfectly for...Continue Reading

Introduction The semiconductor industry is driving the technological revolution, fueling the progress of electronics, computing, and communications. As performance demands rise and chip dimensions continue to be reduced, the material employed for their manufacture must conform to increasingly stringent specifications. High-purity zirconium sputtering targets have become a flagship material for the industry, making it possible to form high-quality metal oxide thin films, gate material, as well as metal interconnect layers. This article...Continue Reading