Company Dynamic | Stanford Advanced Materials

May 6, 2019Julissa GreenBlog, Most Popular, PVD, Sputtering Technology0

Advantages and Disadvantages of Ion Beam Sputtering

Ion Beam Sputtering Definition Ion beam sputtering (IBS), or ion beam deposition (IBD), is a thin film deposition technology that uses an ion source to deposit a sputtering target onto a substrate to produce the highest quality films with excellent precision. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control...

April 29, 2019Julissa GreenBlog, Metal, Rare Earth, Target Application0

Scandium: Rare Earth Element and Application

If there is a metal that is ignored by us, I think that is scandium. Scandium is found in most rare earth elements and uranium deposits, but it can only be extracted from a few mines around the world. Due to the low availability and difficulty in preparation, which was succeeded in 1937, of scandium,...

April 23, 2019Julissa GreenBlog, Cornerstone, Most Popular, Sputtering Technology0

An Overview of Sputtering Deposition

What is Sputtering Deposition? Sputtering deposition, or sputter coating, is one of the physical vapor deposition technology, whereby particles are ejected from a solid target material due to the bombardment of the target by energetic particles. It is an electronic process that deposits thin films of metals or other materials onto a variety of surfaces. Most often,...

April 16, 2019Julissa GreenBlog, Case Study, Evaporation Materials, Most Popular0

Case Study: Silver Evaporation Material Deposition on Glass Surface

The case A well-known industrial glass company—-We attempted to deposit a silver film about one micron thick on the glass substrate using silver evaporation materials by vacuum evaporation. And our existing coating facilities are limited that we can only use electron beam evaporation. We tried Ag / Ti glass in the beginning, but the silver...

April 9, 2019Julissa GreenBlog, PVD, Sputtering Target, Target Application0

Applications of Sputtering Target for Physical Vapor Deposition

The sputtering target is an important material for physical vapor deposition, the most widely used technology for depositing materials. As its name suggests, “physical” means that the PVD coating method involves a purely physical process. During the physical vapor deposition, a solid target material is broken up into the vapor state (usually in a high...

April 2, 2019Julissa GreenBlog, Most Popular, Sputtering Target, Sputtering Technology0

3 Factors Affecting the Deposition Rate in Magnetron Sputtering

Magnetron sputtering is a physical vapor deposition method that allows the deposition of various materials, including metals, oxides, ceramics and etc. by using a specially formed magnetic field applied to a diode sputtering target. The deposition rate, or the film formation rate, is an important parameter that measures the effectiveness of the magnetron sputtering machine....

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