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1. The Core Difference at a Glance Before diving deep, here is the fundamental distinction: PVD (Physical Vapor Deposition): A physical process. A solid material is vaporized in a vacuum and then condenses as a thin film on the substrate. Think of it as transferring material atom-by-atom. CVD (Chemical Vapor Deposition): A chemical process. Gaseous precursors react or decompose on the...Continue Reading

Zinc Oxide (ZnO) sputtering targets are a key material utilized during the deposition process known as magnetron sputtering. In the process, high-energy ions strike the target and eject zinc oxide atoms. The ejected atoms deposit themselves on substrates such as glass, forming a thin yet strong film. These Zinc Oxide films have been greatly helpful...Continue Reading

1. Introduction to Sputtering Targets Sputtering targets are significant commodities for thin-film industries like electronics, optics, and energy sectors. Simply put, a “sputtering target” is the target material utilized for sputtering, a form of physical vapor deposition (PVD). During the PVD process, atoms from a solid target are removed and ejected upon impact by high-energy...Continue Reading