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ST0139 Bismuth Titanate Sputtering Target, Bi4Ti3O12

Chemical Formula: Bi4Ti3O12
Catalog Number: ST0139
CAS Number: 12010-77-4
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Stanford Advanced Materials (SAM) provides the best bismuth titanate sputtering target on the market with a competitive price and great delivery time. Customized forms are available upon request.

Bismuth Titanate MSDS File




Description

Bismuth Titanate Sputtering Target Description

Bismuth titanate sputtering target from Stanford Advanced Materials is an oxide sputtering material with the formula Bi4Ti3O12.

BismuthBismuth is a chemical element that originated from the German ‘Bisemutum’ a corruption of ‘Weisse Masse’ meaning white mass. It was early used in 1753 and discovered by C.F. Geoffroy. “Bi” is the canonical chemical symbol of bismuth. Its atomic number in the periodic table of elements is 83 with location at Period 6 and Group 15, belonging to the p-block. The relative atomic mass of bismuth is 208.98040(1) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Bismuth (Bi) Sputtering Target

TitaniumTitanium is a chemical element that originated from Titans, the sons of the Earth goddess of Greek mythology. It was first mentioned in 1791 and observed by W. Gregor. The isolation was later accomplished and announced by J. Berzelius. “Ti” is the canonical chemical symbol of titanium. Its atomic number in the periodic table of elements is 22 with a location at Period 4 and Group 4, belonging to the d-block. The relative atomic mass of titanium is 47.867(1) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Titanium (Ti) Sputtering Target

OxygenOxygen is a chemical element that originated from the Greek ‘oxy’ and ‘genes’ meaning acid-forming. It was first mentioned in 1771 and observed by W. Scheele. The isolation was later accomplished and announced by W. Scheele. “O” is the canonical chemical symbol of oxygen. Its atomic number in the periodic table of elements is 8 with a location at Period 2 and Group 16, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Oxide Ceramic Sputtering Target

Bismuth Titanate Sputtering Target Handling Notes

1. Indium bonding is recommended for the Bi4Ti3O12 sputtering target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.

2. This material has a low thermal conductivity are susceptible to thermal shock.

Bismuth Titanate Sputtering Target Application

The bismuth titanate sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Bismuth Titanate Sputtering Target Packing

Our bismuth titanate sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

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High-quality bismuth titanate sputtering target is available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with the highest possible density and smallest possible average grain sizes. Please send us an inquiry for the current prices of the sputtering targets and other deposition materials that are not listed.

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Bismuth Titanate Sputtering Target, Bi4Ti3O12
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