Purity:99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape:Discs, Plates, Column Targets, Step Targets, Custom-made
Indium Bonding and Elastomeric Target Bonding Service are available for the metal alloy aluminum copper sputtering target backing plate. Stanford Advanced Materials (SAM) is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.
|Aluminum Copper||1.00″ Dia. x 0.125″ Thick|
|Aluminum Copper||1.00″ Dia. x 0.250″ Thick|
|Aluminum Copper||2.00″ Dia. x 0.125″ Thick|
|Aluminum Copper||2.00″ Dia. x 0.250″ Thick|
|Aluminum Copper||3.00″ Dia. x 0.125″ Thick|
|Aluminum Copper||3.00″ Dia. x 0.250″ Thick|
|Aluminum Copper||4.00″ Dia. x 0.125″ Thick|
|Aluminum Copper||4.00″ Dia. x 0.250″ Thick|
|Aluminum Copper||6.00″ Dia. x 0.250″ Thick|
|Aluminum Copper||8.00″ Dia. x 0.250″ Thick|
We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.
Aluminium, also called aluminum, is a chemical element originated from the Latin name for alum, ‘alumen’ meaningbitter salt. It was first mentioned in 1825 and observed by H.C.Ã˜rsted. The isolation was later accomplished and announced by H.C.Ã˜rsted. “Al” is the canonical chemical symbol of aluminium. Its atomic number in the periodic table of elements is 13 with location at Period 3 and Group 13, belonging to the p-block. The relative atomic mass of aluminium is 26.9815386(8) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Aluminum Sputtering Target
Copper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Copper Sputtering Target
Our metal alloy aluminum-copper sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
SAM’s aluminum copper sputter targets are available in various forms, purities, sizes, and prices. We specialize in producing high purity film coating materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.
Submit your review
Wow! What a great purchase! This pack should last me a long time! Recommended!