Chemical Formula: Nd2CuO4
Catalog Number: ST0459
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Target Bonding Service is available for Neodymium Copper Oxide Sputtering Targets. Stanford Advanced Materials (SAM) is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services.
|Neodymium Copper Oxide, Nd2CuO4||1.00″ Dia. x 0.125″ Thick|
|Neodymium Copper Oxide, Nd2CuO4||1.00″ Dia. x 0.250″ Thick|
|Neodymium Copper Oxide, Nd2CuO4||2.00″ Dia. x 0.250″ Thick|
|Neodymium Copper Oxide, Nd2CuO4||3.00″ Dia. x 0.125″ Thick|
Neodymium is a chemical element originated from the Greek ‘neos didymos’ meaning new twin. It was first mentioned in 1885 and observed by A. von Welsbach. “Nd” is the canonical chemical symbol of neodymium. Its atomic number in the periodic table of elements is 60 with location at Period 6 and Group 3, belonging to the f-block. The relative atomic mass of neodymium is 144.242(3) Dalton, the number in the brackets indicating the uncertainty.
Copper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.
Our Neodymium Copper Oxide Sputter Targets are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.
We specialize in producing high purity Neodymium Copper Oxide Sputtering Target with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.
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