|Purity||99.9%, 99.95%, 99.99%, 99.995%, 99.999%|
|Shape||Discs, Plates, Column Targets, Step Targets, Custom-made|
The Copper(I) Sulfide Sputtering Target is available in various forms, purities, and sizes. Stanford Advanced Materials (SAM) offers high-quality Copper(I) Sulfide Sputtering Targets at the most competitive prices.
Copper(I) Sulfide Sputtering Target is a specialized material used in the sputter deposition process to create thin films of copper sulfide on a substrate. Sputter deposition is a widely used technique in manufacturing electronic and optoelectronic devices, solar cells, and various other applications where thin films with specific properties are required.
Copper sulfide materials can be used in the fabrication of semiconductors, photovoltaic devices, and sensors.
In the sputtering process, the Copper Sulfide Sputtering Target is bombarded with high-energy ions, causing atoms or molecules to be ejected from the target material. These ejected particles then deposit onto a substrate, forming a thin film of copper sulfide. The thickness and composition of the thin film can be precisely controlled during the sputtering process.
|Melting Point (℃)||1130|
|Boiling Point (℃)||N/A|
|Available Sizes||Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″
Copper(I) Sulfide Sputtering Target is used in the fabrication of semiconductors, photovoltaic devices, and sensors.
Our Copper(I) Sulfide Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.
SAM’s Copper(I) Sulfide Sputtering Targets are available in various forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.