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(949) 407-8904 Mon - Fri 09:00 - 18:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 09:00 - 18:00 23661 Birtcher Dr., Lake Forest, California, USA

Copper Sulfide (CuS) Sputtering Target

Chemical Formula: CuS
Catalog Number: ST0277
CAS Number: 1317-40-4
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made




Description

Target Bonding of Copper Sulfide Sputtering Target

Indium bonding and Elastomer bonding are available for the copper sulfide sputtering targets. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.Target Bonding Services

Specification of Copper Sulfide Sputtering Target

Material Type Copper Sulfide
Symbol CuS
Color/Appearance Black target
Melting Point 500 °C (932 °F)
Density 4.6 g/cm3
Sputter RF, RF-R
Type of Bond Indium, Elastomer

Chemical Elements of Copper Sulfide

CopperCopper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Copper Sputtering Target

SulfurSulfur, also called sulphur, is a chemical element originated from Either from the Sanskrit ‘sulvere’, or the Latin ‘sulfurium’, both names for sulfur. It was early used before 2000 BC and discovered by Chinese and Indians. “S” is the canonical chemical symbol of sulfur. Its atomic number in the periodic table of elements is 16 with location at Period 3 and Group 16, belonging to the p-block. The relative atomic mass of sulfur is 32.065(5) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Sulfide Ceramic Sputtering Target

Packing

Our copper sulfide sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Get Contact

SAM’s copper sulfide sputtering targets are available in various forms, purities, and sizes. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.

 

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Copper Sulfide (CuS) Sputtering Target
Average rating:  
 1 reviews
by Paul Morissette on Copper Sulfide (CuS) Sputtering Target

Product delivered just as requested and easy to put together.

Great customer service.

Will buy SAM’s Products again.