Chemical Formula: Cr2N
Catalog Number: ST0210
CAS Number: 12053-27-9
Purity: 99.5%, 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
The chromium nitride sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers high-quality chromium nitride sputter targets at the most competitive prices.
Chromium Nitride sputtering target from Stanford Advanced Materials is a nitride ceramic sputtering material with the formula Cr2N.
Chromium is a chemical element that originated from the Greek ‘chroma’, meaning color. It was early used before 1 AD and discovered by Terracotta Army. “Cr” is the canonical chemical symbol of chromium. Its atomic number in the periodic table of elements is 24 with a location at Period 4 and Group 6, belonging to the d-block. The relative atomic mass of chromium is 51.9961(6) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Chromium Sputtering Target
Nitrogen is a chemical element that originated from the Greek ‘nitron’ and ‘genes’ meaning nitre-forming. It was first mentioned in 1772 and observed by D. Rutherford. The isolation was later accomplished and announced by D. Rutherford. “N” is the canonical chemical symbol of nitrogen. Its atomic number in the periodic table of elements is 7 with a location at Period 2 and Group 15, belonging to the p-block. The relative atomic mass of nitrogen is 14.0067(2) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Nitride Ceramic Sputtering Target
Our chromium nitride sputter targets are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.
High-quality chromium nitride sputtering target is available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with the highest possible density and smallest possible average grain sizes. Please send us an inquiry for the current prices of the sputtering targets and other deposition materials that are not listed.