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  Introduction Gallium phosphide (GaP) is a compound semiconductor material that has gained increasing attention in the semiconductor industry. GaP wafers offer several advantages over traditional silicon wafers, including high efficiency, high-speed operation, and high power handling capabilities. In this article, we will talk about the benefits of using gallium phosphide wafers in electronic and...Continue Reading

Introduction to Indium Bonding Target bonding is a significant process that joins sputtering targets and backing plates together, yet improper bonding materials would lead to poor heat release, cracking, non-uniform deposition, and even de-bonding. Therefore, it is quite essential to have a basic understanding of the functions, benefits, and types of bonding in advance. This...Continue Reading

Introduction Terbium sputtering targets are made from terbium metal. They are used widely in a range of sectors such as tool coatings, optics coatings, and solar coatings. Let’s have a detailed discussion about the features, production, and applications of terbium sputtering targets. Properties Terbium sputtering targets share similar features with terbium metal. Terbium the element...Continue Reading