Our Zinc (Zn) Planar Sputtering Targets are manufactured from high-purity elemental zinc, serving as a fundamental source material for depositing conductive, transparent, and protective thin films. Zinc’s relatively low melting point and high vapor pressure make it an efficient sputtering source for applications ranging from transparent electrodes in solar cells to sacrificial anti-corrosion coatings in harsh environments.
| Product Code | ST11219 (Standard Reference) |
| Material | Zinc (Zn) |
| Typical Purity | ≥ 99.99% (4N) |
| Form & Shape | Planar Sputtering Target (Rectangular/Disc) |
| Key Properties | Low Melting Point (~420°C) | High Vapor Pressure | Excellent Sacrificial Corrosion Protection |
| Key Advantage | Provides an efficient, high-purity source for depositing zinc films and, through reactive sputtering, high-quality zinc oxide (ZnO)—a versatile semiconductor with wide applications in optoelectronics and sensing. |
Key Advantage: Enables deposition of pure zinc for corrosion protection or as a dopant source, and serves as the primary target for reactive sputtering of ZnO—a key material for transparent conductive oxides (TCOs) and piezoelectric devices.
Customization: Purity (99.99% to 99.9999%), dimensions (thickness, width, length), bonding, and surface finish are fully customizable to match specific deposition systems and process requirements.
Primary Applications: Precursor for aluminum-doped zinc oxide (AZO) TCOs in solar cells and displays; sacrificial anti-corrosion coatings (galvanic protection); seed layers for ZnO nanowire growth; dopant source in compound semiconductors; transparent electrodes in touch panels.
Comprehensive specifications for sputtering zinc films and reactive deposition of zinc oxide.
| Parameter | Specification / Details |
|---|---|
| Material | Zinc (Zn) |
| Typical Purity | ≥ 99.99% (4N Standard), 5N and 6N available |
| Crystal Structure | Hexagonal Close-Packed (HCP) |
| Density | 7.14 g/cm³ |
| Melting Point | 419.5 °C (787.1 °F) |
| Vapor Pressure | Relatively high at typical sputtering temperatures |
| Standard Shape | Planar – Rectangular, Circular (Disc) |
| Dimensions | Fully Customizable (Thickness, Width, Length, Diameter) |
| Surface Finish | Machined and cleaned to minimize oxides; can be supplied with protective coating |
| Bonding Option | Available bonded to Cu or Al backing plates using low-temperature solders (e.g., In) or elastomer bonding due to Zn’s low melting point |
| Manufacturing Method | High-purity casting, rolling, and machining under controlled atmosphere |
| Special Handling Note | Zinc is relatively soft and can oxidize; targets are typically packaged under inert gas or with desiccants |
| Quality Documentation | Certificate of Analysis with GDMS/ICP purity verification |
The primary use of high-purity zinc targets is for reactive sputtering of ZnO, a material with exceptional versatility:
Metallic zinc films also serve important purposes:
Sputtering zinc requires attention to its specific material properties:
Stanford Advanced Materials ensures the highest quality for zinc targets:
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