|Purity||99.9%, 99.95%, 99.99%, 99.995%, 99.999%|
|Shape||Discs, Plates, Column Targets, Step Targets, Custom-made|
The Iron Hafnium Sputtering Target is available in various forms, purities, and sizes. Stanford Advanced Materials (SAM) offers high-quality Iron Hafnium Sputtering Targets at the most competitive prices.
Iron Hafnium Sputtering Target is a specialized material used in the sputter deposition process, a technique employed to deposit thin films of material onto a substrate in a controlled and precise manner. This process is commonly used in manufacturing electronic devices, semiconductors, and various thin-film applications.
The combination of iron and hafnium in a sputtering target suggests the creation of a thin film that incorporates both elements. The specific application and properties of the resulting film would depend on the desired characteristics and functionality.
|Melting Point (℃)||N/A|
|Boiling Point (℃)||N/A|
|Available Sizes||Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″
Iron Hafnium Sputtering Target is commonly used in the manufacturing of electronic devices, semiconductors, and various thin-film applications.
Our Iron Hafnium Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.
SAM’s Iron Hafnium Sputtering Targets are available in various forms, purities, and sizes. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.