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(949) 407-8904
Mon - Fri 08:00 - 17:00
23661 Birtcher Dr., Lake Forest, California, USA
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Home
Product
Sputtering Target
By Target Materials
By Material Names A – Z
By Chemical Elements
Evaporation Materials
By Evaporation Materials
By Material Names A – Z
By Chemical Elements
Precious Metal
Precious Metal Crucible
Precious Metal Wire
Precious Metal Sputtering Target
Precious Metal Evaporation Materials
Bonding Service
Indium Target Bonding Service
OFHC Copper Backing Plates
Elastomeric Target Bonding Service
Reclaim Service
Rotatory Targets
Planar Targets
Evaporation Sources
Thermal sources
E-Beam Source Used Crucibles
3D Printing Powder
Crystal Substrates
Thermal Spraying Coating
Application
Architectural, Automotive Glass & WEB Coating
Semiconductor Materials
Hardware & Decorative Coatings
Optics Coatings
Solar
Electronics
Inquiry
FAQ
About Us
NEWS
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MSDS3
Material Safety Data Sheets (MSDS) – Page 3
Sputtering Target
Formula
CAS Number
Available Purities
MSDS File
Nickel
Ni
7440-02-0
99.9%, 99.99%, 99.995%
Niobium
Nb
7440-3-1
99.95%, 99.99%
Palladium
Pd
7440-5-3
99.95%
Platinum
Pt
7440-6-4
99.99%
Praseodymium
Pr
7440-10-0
99.9%
Rhenium
Re
7440-15-5
99.99%
Rhodium
Rh
7440-16-6
99.9%
Ruthenium
Ru
7440-18-8
99.95%
Samarium
Sm
7440-19-9
99.9%
Scandium
Sc
7440-20-2
99.9%, 99.95%, 99.99%
Selenium
Se
7782-49-2
>99.99%, 99.999%
N-type Silicon
Si
7440-21-3
99.9%, 99.95%, 99.99%, 99.995%, 99.999%
P-type Silicon
Si
7440-21-3
99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Pure Silicon
Si
7440-21-3
99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Silver
Ag
7440-22-4
99.99%
Tantalum
Ta
7440-25-7
99.95%
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