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(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0880 Beryllium Copper Sputtering Target, BeCu

Chemical Formula: BeCu
Catalog Number: ST0880
CAS No.: 11108-64-8
Purity: 99.999%
Shape: Planar, Rotary, Custom-made

Stanford Advanced Materials (SAM) is expert at providing high-quality Beryllium Copper Sputtering Target at competitive pricing. We also customize various shapes according to your requirements or drawings.




Description

Beryllium Copper Sputtering Target Description

Beryllium Copper Sputtering Target

Beryllium Copper Sputtering Target from Stanford Advanced Materials is an alloy sputtering material with the formula BeCu. Beryllium Copper Sputtering Target features higher strength and hardness compared to commercial copper alloys. BeCu alloy also has excellent resistance to stress relaxation at high temperatures.

Related Product: Rotatory Copper (Cu) Sputtering Target, Beryllium Oxide Sputtering Target

Beryllium Copper Sputtering Target Specifications

Material Beryllium Copper
Symbol BeCu
Color/Appearance Golden, metallic
Melting Point 870-980 ℃
Density (g/cm3) 8.6
Available sizes Planar: 500x500x10mm

Rotary: L4000mm

Beryllium Copper Sputtering Target Applications

Beryllium Copper Sputtering Target is used for shielding room, IC shielding layer and decorative coatings.

Beryllium Copper Sputtering Target Packing

Our Beryllium Copper Sputtering Target is tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Get Contact

High-quality Beryllium Copper Sputtering Target is available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with the highest possible density and smallest possible average grain sizes. Please send us an inquiry for the current prices of the sputtering targets and other deposition materials that are not listed.