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An Overview of Aluminum Sputtering Target

An Overview of Aluminum Sputtering Target

Aluminum sputtering target can be considered a product after a series of processes from high-purity aluminum. It is a type of sputtering materials used mounted on a vacuum coating machine to deposit a film in the vacuum coating industry. The property of the sputtering target directly affects the performance of the obtained film.

Physical properties

Chemical Formula  Al
CAS Number  7429-90-5
Material Type Aluminum
Atomic Weight  26.9815386
Atomic Number  13
Color/Appearance  Silvery, Metallic
Thermal Conductivity  235 W/m.K
Melting Point (°C)  660
Coefficient of Thermal Expansion  23.1 x 10-6/K
Theoretical Density (g/cc)  2.7
Sputter  DC
Aluminum Titanium Sputtering Target
Aluminum Titanium Sputtering Target


Aluminum target can be used in DC dipole sputtering, three-pole sputtering, four-stage sputtering, RF sputtering, counter target sputtering, ion beam sputtering, magnetron sputtering to produce reflective film, conductive film, semiconductor film, capacitor film, decorative film, protective film, integrated circuit, display, and etc. Compared with other sputtering targets, the price of aluminum targets is lower, so it is a preferred choice under the premise of satisfying the function of the film layer.


Aluminum target can be divided into planar target and rotatory target. Planar aluminum targets are sheet-shaped, with round, square, and other shapes. Rotatory aluminum target is tubular and has high utilization efficiency. But the process of making rotatory target is much more difficult. A rotatory aluminum sputtering target can be obtained through the high-purity aluminum extrusion, stretching, straightening heat treatment, machining and other processing steps.

Manufacturing method

By extracting Al2O3 from bauxite and electrolyzing them in molten cryolite, we can obtain the aluminum with purity higher than 99%. But it is not pure enough to be a raw material for producing aluminum targets. The high-purity aluminum used in aluminum target can be produced by segregation method, three-layer electrolysis method or combined regional melting method. Thus it is much more expensive than industrial pure aluminum.

The high-purity aluminum ingot is the raw material to make aluminum sputtering target. It has to go through the following process: forge, roll and heat. After that, the aluminum ingot achieves fine crystal grains and high density that could meet the requirement of the aluminum target.

Then, the deformed high-purity aluminum ingot is processed into a size which can match the vacuum coater. The requirements for aluminum target processing are high precision and high surface quality.

Current situation

Target Name Aluminum sputtering target
Common Purity 99.9%(3N) 99.99%(4N) 99.999%(5N) 99.9999%(6N)
Common Size 100*40mm
Maximum Size Width 3000mm


With the rapid development of the electronics industry, the demand for aluminum targets is also increasing. There is still room for improvement in the purity of aluminum targets; in addition, market standardization of aluminum targets needs to be strengthened.

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About the author

Julissa Green graduated from the University of Texas studying applied chemistry. She started her journalism life as a chemistry specialist in Stanford Advanced Materials (SAM) since 2016 and she has been fascinated by this fast growing industry ever since. If you have any particular topics of interest, or you have any questions, you can reach her at [email protected]

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