ST11211 High-Purity Tin (Sn) Planar Sputtering Target

Complete Technical Specifications

For detailed evaluation and procurement (Product Code: ST11211).

Technical & Application Notes

1. Enabling Advanced Electronics Packaging & Interconnects

Tin’s primary role in microelectronics is in forming reliable interconnections:

• Solder Bumps & Under-Bump Metallization (UBM): Pure tin or tin-alloy films are sputtered as a key layer in wafer-level packaging (WLP) and flip-chip technologies to create solderable surfaces. High purity is essential to prevent Kirkendall voiding and ensure joint reliability.
• Low-Temperature Conductive Layers: For devices on temperature-sensitive substrates (e.g., flexible electronics, polymers), tin provides a conductive pathway that can be deposited with minimal thermal budget.

Target Key: A high-density, flat planar target is critical to avoid arcing and particulate generation that would cause defects in fine-pitch bump structures.

2. Transparent Conductive Oxides (TCO) & Optoelectronics

Tin is a vital precursor for transparent conductive films:

• Tin Oxide (SnO₂): Sputtering from a pure Sn target in a reactive oxygen atmosphere is a common method to deposit SnO₂ films. These are used as transparent electrodes in touch screens, solar cells, and gas sensors due to their good conductivity and transparency.
• Fluorine-Doped Tin Oxide (FTO): A workhorse TCO material for photovoltaic devices and low-emissivity glass. The properties of the sputtered film are highly dependent on the purity and microstructure of the starting tin target.

3. Energy Storage & Functional Coatings

• Lithium-Ion Battery Anodes: Tin and tin-oxide films are investigated as high-capacity anode materials. Sputtering allows for precise control of film thickness and composition for research and development of next-generation batteries.
• Corrosion-Resistant Coatings: Thin tin coatings provide sacrificial or barrier protection for steel and other metals in food packaging and mild environmental applications.
• Superconducting Precursor: Tin is a component in low-temperature superconducting compounds like Nb₃Sn, where high-purity tin films may be used in precursor deposition processes.

4. Sputtering Process & Handling Considerations

Tin’s low melting point and susceptibility to oxidation require careful process design:

• Low-Power Sputtering Regime: DC power must be carefully controlled with effective cooling to prevent target surface melting and the formation of micro-droplets (“splashing”) that degrade film quality.
• Effective Cooling & Bonding: Excellent thermal contact between the planar target and the water-cooled backing plate is non-negotiable for stable operation.
• Oxidation Prevention: Targets should be stored in vacuum-sealed packaging. Sputtering chambers should have low base pressures and may benefit from gettering to minimize oxide formation on the film.
• Soft Material Handling: Tin is a soft metal; targets require careful handling and robust packaging to prevent surface scratches or dents.

Quality Assurance

Our quality protocol for tin targets addresses its specific challenges:

1. High-Density Manufacturing: Processes are optimized to achieve near-theoretical density, minimizing porosity that can trap gases and cause arcing.
2. Surface Profilometry: Verifies the critical planar flatness and surface roughness to ensure uniform erosion and thermal contact.
3. Trace Impurity Analysis (GDMS/ICP-MS): Especially focuses on elements like lead (Pb), bismuth (Bi), and antimony (Sb), which are detrimental to solder joint integrity and electronic performance.

Why Stanford Advanced Materials (SAM)

• Expertise in Low-Melting Point Metals: We understand the unique fabrication and handling challenges of materials like tin, ensuring targets are delivered with optimal density and surface quality.
• Purity for Electronics: We supply tin with impurity levels tailored for high-reliability electronic and solder applications.
• Full Supply Chain Control: From material sourcing to vacuum packaging, we control every step to prevent oxidation and contamination.

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Specify Your Tin Film Application
To recommend the best tin target solution, please provide:

1. Primary application (e.g., solder UBM, SnO₂ TCO, battery research, protective coating).
2. Required purity grade and any specific impurity limits (e.g., max Pb content).
3. Target dimensions and whether reactive sputtering (with O₂) is planned.