ST11205 Nickel Vanadium (NiV) Rotary Sputtering Target

Complete Technical Specifications

For detailed evaluation and procurement (Standard Reference: ST11205).

Technical & Application Notes

1. An Engineered Barrier for Advanced Interconnects

In semiconductor metallization, as feature sizes shrink, preventing copper diffusion into dielectrics is critical. NiV alloys (with ~5-10% V) are investigated as a single-material barrier/liner. Vanadium effectively pins grain boundaries in nickel, creating a denser, more amorphous-like film structure that offers superior diffusion barrier performance at reduced thickness compared to pure nickel, potentially enabling further scaling.

2. Enhancing Surface Durability and Aesthetics

Beyond electronics, NiV films provide functional surface properties:

• Wear & Corrosion Resistance: The fine-grained, hard NiV coating improves the durability of tools, molds, and industrial components.
• Decorative Coatings: Can produce a range of stable, tarnish-resistant finishes from silver-white to light gray tones for consumer goods and architectural hardware.

3. A Model System for Catalytic Research

Nickel-vanadium alloys are studied as catalysts for various reactions, including hydrocarbon reforming and hydrogenation. Sputtered NiV thin films provide a well-defined, compositionally controlled model system for high-throughput catalyst screening and fundamental studies of synergistic effects between the two metals.

4. Why Rotary Design for NiV Targets?

For semiconductor production or large-area coating, uniformity is key:

• Uniform Barrier Thickness: Critical for consistent device performance and yield across wafers.
• High-Throughput Deposition: Meets the volume requirements of production environments.

Quality Assurance

We verify the precise Ni:V ratio using Inductively Coupled Plasma (ICP) analysis. Microstructural homogeneity is checked via microscopy to ensure the vanadium is evenly distributed, which is crucial for predictable and uniform film properties, especially in barrier layer applications.

Why Stanford Advanced Materials (SAM)

• Focus on Advanced Metallization: We understand the material challenges in semiconductor scaling and provide alloys like NiV for next-generation solutions.
• Precision Alloying for Functional Films: We accurately control minor additions like vanadium to achieve specific film microstructures and properties.
• Proven in Demanding Applications: Our targets meet the reliability standards of both electronics and industrial coating sectors.

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Get a Formal Quote or Composition Consultation
To specify the optimal NiV alloy for your process, please provide:

1. Desired Vanadium content (at.% or wt.%) and primary application (e.g., diffusion barrier, wear coating).
2. Rotary target dimensions or your cathode model.
3. Substrate details and key film property requirements.