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ST11186 Copper Nickel Titanium (CuNiTi) Rotary Sputtering Target

Our Copper Nickel Titanium (CuNiTi) Rotary Sputtering Targets are engineered for depositing advanced functional films, most notably in the field of thin-film Shape Memory Alloys (SMAs). This ternary system allows precise tuning of the martensitic transformation temperature, enabling the fabrication of micro-actuators, sensors, and smart coatings with tailored thermal and mechanical response.

Material Copper Nickel Titanium Alloy (CuNiTi)
Key Property Precursor for Tunable Shape Memory Alloy Films
Typical System Based on TiNi with Cu substitution (e.g., TiNiCu)
Purity ≥ 99.9% (Metal Basis)
Form Rotary Sputtering Target (Tubular)

Key Advantage: Enables the deposition of ternary SMA films (e.g., TiNiCu) where Copper substitution for Nickel sharpens the transformation hysteresis and lowers transformation stress, critical for precise micro-electromechanical systems (MEMS) actuation.
Customization: Precise control over Cu/Ni/Ti ratios to target specific transformation temperatures (Mₛ, Aₛ) and properties.
Typical Applications: MEMS actuators & sensors, biomedical micro-devices, adaptive optics, anti-scaling coatings, and research on novel functional films.




Description

Complete Technical Specifications

For detailed evaluation and procurement (Standard Reference: ST11186).

Parameter Specification / Typical Value
Material Copper Nickel Titanium Alloy (CuNiTi)
Composition Base Ti-rich, with Cu substituting for Ni in TiNi system
Example Composition Ti₅₀Ni₄₀Cu₁₀ (at.%), Ti₅₀Ni₃₅Cu₁₅ (Customizable)
Purity (Metal Basis) ≥ 99.9%
Density ~6.5 – 7.0 g/cm³ (Alloy dependent)
Transformation Temp. Tunable from below 0°C to above 100°C (Film dependent)
Standard Shape Tubular (Rotary Target)
Key Dimensions Custom OD, ID, Length
Sputtering Method DC Magnetron (for conductive alloys)
Bonding/Integration Compatible with rotary cathode systems
Certification Certificate of Composition (CoC) provided

Technical & Application Notes

1. Engineering the Shape Memory Effect at the Micro Scale
The TiNi (Nitinol) binary system is the most common SMA, but adding a third element like Copper (Cu) offers significant advantages for thin-film applications:

  • Reduced Hysteresis: Cu substitution narrows the temperature gap between martensitic and austenitic transformations, allowing for more precise thermal control in actuators.

  • Lower Stress: Decreases the stress required for transformation, which is beneficial for delicate MEMS structures.

  • Improved Stability: Can enhance cyclic stability and resistance to fatigue in repeated actuation.
    Our CuNiTi target provides the single-source precursor to deposit these optimized ternary alloy films uniformly over large areas or wafers.

2. Why Rotary Targets for SMA Film Deposition?
For research and potential production of MEMS devices on wafers or large substrates, uniformity is paramount.

  • Compositional Uniformity: Critical for ensuring consistent transformation temperature and actuation performance across an entire device array or wafer.

  • High-Throughput Capability: Rotary design supports efficient deposition for R&D scaling and potential volume manufacturing.

  • Material Efficiency: Maximizes the use of these high-value, specialty alloy materials.

3. The Challenge of Homogeneous Ternary Alloying
Achieving a homogeneous mixture of Ti (high melting point, reactive) with Cu and Ni (lower melting points) is non-trivial. Segregation can lead to films with multiple phases and unreliable properties. SAM employs Vacuum Arc Melting or Plasma Melting under inert atmosphere with repeated flipping/remelting, followed by homogenization heat treatments, to produce a uniform, single-phase or fine two-phase ingot before machining into the rotary target.

Quality Assurance

Given the sensitivity of SMA properties to composition, we perform Wavelength Dispersive Spectroscopy (WDS) for the most accurate quantitative analysis of Ti, Ni, and Cu. X-ray Diffraction (XRD) is used to identify the phases present in the target material (e.g., B2 austenite, martensite). Microstructural homogeneity is confirmed via SEM/EDS mapping. This ensures the target will sputter a consistent flux, leading to reproducible thin-film properties.

Why Stanford Advanced Materials (SAM)

  • Specialist in Functional Alloys: We focus on materials with engineered properties, like SMAs, beyond standard conductive or protective coatings.
  • Precision in Complex Systems: We excel at producing homogeneous targets from ternary and quaternary systems with reactive elements.
  • Partner for Advanced Research: We collaborate with leading MEMS and smart materials labs to fabricate targets that enable groundbreaking research and device development.

Request More Information

Discuss Your SMA Film Requirements & Request a Quote
This target is designed for specialized research and development. To specify your needs, please provide:

  1. Desired composition (target at.% of Ti, Ni, Cu) or the specific transformation temperature range you are aiming for.
  2. Rotary target dimensions or substrate size.
  3. Application focus (e.g., MEMS actuator, biomedical sensor, adaptive optics).