Engineered for productivity, our high-purity Aluminum Rotary Targets maximize material utilization and film uniformity in large-area or high-volume sputtering systems, offering a cost-effective solution for semiconductor, display, and architectural glass coating.
| Material | Aluminum (Al) |
| Purity | ≥ 99.99% (4N) |
| Form | Rotary Sputtering Target (Tubular) |
| Key Benefit | High Material Utilization (>80%) |
Key Advantage: Tubular design enables uniform erosion, high deposition rates, and significantly extended target life compared to planar targets.
Customization: Outer Diameter (OD), Inner Diameter (ID), Length, and wall thickness tailored to your rotary magnetron.
Typical Applications: Large-area display (TFT) metallization, architectural & automotive glass coating, roll-to-roll flexible electronics, and high-volume semiconductor packaging.
For detailed evaluation and procurement (Standard Reference: ST11167).
| Parameter | Specification / Typical Value | Notes / Process Relevance |
|---|---|---|
| Material | Aluminum (Al) | — |
| Purity (Standard) | ≥ 99.99% (4N) | Ensures low film resistivity and high reflectivity; critical for optoelectronic performance. |
| Density | ≥ 2.69 g/cm³ (Theoretical: 2.70 g/cm³) | High, uniform density is essential for stable thermal management and consistent erosion profile. |
| Grain Structure | Fine, Homogeneous | Controlled grain size minimizes arcing and particulate generation during continuous rotation. |
| Standard Shape | Tubular (Cylindrical) | Seamless tube construction for uniform magnetic field coupling. |
| Key Dimensions | Custom OD, ID, Length | Precise machining ensures optimal fit and thermal contact with the cooling mandrel. |
| Wall Thickness | Customizable (Typical range: 6-12 mm) | Balanced for optimal material usage, structural integrity, and thermal performance. |
| Thermal Conductivity | ~235 W/(m·K) | Excellent heat dissipation through the tube wall to the cooling system. |
| Electrical Resistivity | ~2.65 µΩ·cm @ 20°C | — |
| Melting Point | 660.3 °C | — |
| Coeff. of Thermal Expansion | ~23.1 x 10⁻⁶ /K | Critical for managing thermal stress between target and bonding layer/cooling tube. |
| Sputtering Method | DC Magnetron (Optimized) | The rotary design is ideal for high-power, high-duty-cycle DC sputtering. |
| Bonding/Integration | Often used with a dedicated cooling mandrel; bonding services available. | Ensures efficient heat transfer and mechanical stability during rotation. |
| Certification | Certificate of Analysis (CoA) provided | Confirms purity, dimensions, and key physical properties. |
1. The Productivity Advantage of Rotary Design
The cylindrical geometry of a rotary target allows the entire circumference to be used as the sputtering surface. As it rotates, heat and wear are distributed evenly, dramatically reducing the “racetrack” erosion common in planar targets. This leads to:
Material Utilization >80%: Significantly reduces cost-per-deposited-film compared to planar targets (~30-40% utilization).
Extended Operational Life: Longer continuous run times reduce system downtime for target changes.
Improved Film Uniformity: More consistent target-to-substrate distance and erosion profile over time.
2. Precision Engineering for Reliable Integration
A rotary target is a dynamic component. Our manufacturing focuses on:
Concentricity & Straightness: Critical to prevent vibration and ensure uniform magnetic field strength across the target surface.
Wall Thickness Uniformity: Essential for consistent thermal dissipation and predictable erosion rates.
Surface Finish: A controlled finish minimizes initial arcing and particle generation.
3. Application-Specific Guidance
Flat Panel Display (FPD) Manufacturing: The standard for depositing aluminum gate lines and data lines in TFT-LCD and OLED displays. High purity and uniformity are non-negotiable for yield.
Architectural & Automotive Glass: Used to deposit low-emissivity (Low-E) and solar control coatings in large, in-line sputtering systems. High throughput and target life are key economic drivers.
Flexible & Printed Electronics: Ideal for roll-to-roll coaters requiring uniform, high-conductivity metal layers over wide webs.
Semiconductor Packaging: Used in high-volume systems for depositing redistribution layers (RDLs) and other interconnects.
Each Aluminum Rotary Target undergoes rigorous inspection, including ultrasonic testing for internal integrity, precise dimensional mapping via laser scanners, and microstructural analysis. We verify concentricity, straightness, and wall thickness to ensure trouble-free integration and operation in your high-precision rotary cathode.
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