Molybdenum (Mo) Sputtering Target

Planar and Rotary Molybdenum Sputtering Target

Our planar molybdenum sputtering targets have high purity & density and uniform microstructure that can be perfectly applied in depositing thin films in TFT displays and other related industries. Both of single and multi-piece molybdenum planar targets are available.

Our rotatory molybdenum sputtering targets have a high utilization rate of more than 75% that ensure you make full use of the target materials.

Target Bonding of Molybdenum Sputtering Target

Indium Bonding and Elastomeric Target Bonding Service are available for Molybdenum Sputtering Target. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.

Specification of Molybdenum Sputtering Target

Available Sizes of Molybdenum Sputtering Target

We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.

Description of Molybdenum Sputtering Target

Molybdenum is a chemical element originated from the Greek ‘molybdos’ meaning lead. It was first mentioned in 1778 and observed by W. Scheele. The isolation was later accomplished and announced by J. Hjelm. “Mo” is the canonical chemical symbol of molybdenum. Its atomic number in the periodic table of elements is 42 with location at Period 5 and Group 6, belonging to the d-block. The relative atomic mass of molybdenum is 95.94(2) Dalton, the number in the brackets indicating the uncertainty.

Molybdenum targets have a density of almost 100 %. You benefit from a faster process due to higher sputtering speeds. The denser the molybdenum target is, the better the conductivity of the created layer. SAM specializes in producing high purity Molybdenum Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in the PVD, CVD, APS and VPS coating processes.

Application of Molybdenum Sputtering Target

Sputtering is a process whereby atoms are ejected from a solid target material due to the bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition. Molybdenum sputtering target is used for CD-ROM, decoration, flat panel displays, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Packaging

Our molybdenum sputter targets are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.

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We specialize in producing high purity molybdenum sputter targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.  Get an inquiry right now.