| Chemical Formula | Ba2Cu3O7Y |
| Catalog No. | ST0921 |
| CAS Number | 107539-20-8 |
| Purity | 99.9%, 99.95%, 99.99%, 99.995%, 99.999% |
| Shape | Discs, Plates, Column Targets, Step Targets, Custom-made |
The Yttrium Barium Cuprate Sputtering Target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers Yttrium Barium Cuprate Sputtering Targets renowned for exceptional quality, all at highly competitive prices.
Yttrium Barium Cuprate Sputtering Target is a specialized material used in the sputter deposition process. Sputter deposition is a technique employed in the production of thin films for various applications in electronics and superconductivity.
The sputter deposition process involves bombarding the target material (Yttrium Barium Cuprate Sputtering Target) with high-energy ions in a vacuum chamber. This causes atoms or particles from the target material to be ejected, and these ejected particles then deposit onto a substrate, forming a thin film.
Related Product: Yttrium Oxide Sputtering Target
| Compound Formula | Ba2Cu3O7Y |
| Molecular Weight | 666.19 |
| Appearance | Black Target |
| Melting Point | >1000℃ |
| Density (g/cm3) | 6.3 |
| Available Sizes | Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Yttrium Barium Cuprate Sputtering Target is widely used in various applications in electronics and superconductivity.
Our Yttrium Barium Cuprate Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.
SAM’s Yttrium Barium Cuprate Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.
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