Chemical Formula: NiSi2
Catalog Number: ST0266
CAS Number: 12201-89-7
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Nickel silicide sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers high quality NiSi2 sputtering targets at the most competitive price.
Nickel silicide sputtering target is a type of silicide ceramic sputtering target composed of nickel and silicon.
Nickel is a chemical element originated from the shortened of the German ‘kupfernickel’ meaning either devil’s copper or St. Nicholas’s copper. It was first mentioned in 1751 and observed by F. Cronstedt. The isolation was later accomplished and announced by F. Cronstedt. “Ni” is the canonical chemical symbol of nickel. Its atomic number in the periodic table of elements is 28 with location at Period 4 and Group 10, belonging to the d-block. The relative atomic mass of nickel is 58.6934(2) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Nickel Sputtering Target
Silicon is a chemical element originated from the Latin ‘silex’ or ‘silicis’, meaning flint. It was first mentioned in 1824 and observed by J. Berzelius. The isolation was later accomplished and announced by J. Berzelius. “Si” is the canonical chemical symbol of silicon. Its atomic number in the periodic table of elements is 14 with location at Period 3 and Group 14, belonging to the p-block. The relative atomic mass of silicon is 28.0855(3) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Silicide Ceramic Sputtering Target
The nickel silicide sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.
Our nickel silicide sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
SAM’s nickel silicide sputtering targets are available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Please send us an inquiry for the current prices of sputtering targets and other deposition materials that are not listed.
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