Chemical Formula: Re
Catalog Number: ST0037
CAS Number: 7440-15-5
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Rhenium sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) is your one-stop source to find rhenium sputter targets for sale.
Rhenium sputtering target is a silvery gray target composed of high purity rhenium metal. Rhenium is a chemical element originated from Rhine, a river that flows from Grisons in the eastern Swiss Alps to the North Sea coast in the Netherlands (with the Latin name Rhenia). It was first mentioned in 1908 and observed by M. Ogawa. The isolation was later accomplished and announced by M. Ogawa. “Re” is the canonical chemical symbol of rhenium. Its atomic number in the periodic table of elements is 75 with a location at Period 6 and Group 7, belonging to the d-block. The relative atomic mass of rhenium is 186.207(1) Dalton, the number in the brackets indicating the uncertainty.
|Melting Point||3180 °C|
|Thermal Conductivity||0.480 W/cm/K @ 25 °C|
|Electrical Resistivity||19.3 microhm-cm @ 20°C|
|Available Sizes||Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″
We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.
Our rhenium sputter targets are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.
SAM’s rhenium sputtering targets are available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film deposition materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Please send us an inquiry for the current prices of the sputtering targets and other deposition materials that are not listed.
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Quick delivery and good package. Perfect for film coating and sputter deposition.