(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0179 Nickel Oxide Sputtering Target, NiO

Chemical Formula: NiO
Catalog Number: ST0179
CAS Number: 1313-99-1
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Stanford Advanced Materials (SAM) provides nickel oxide sputtering targets with a wide range of sizes and purity grades. We also customize various shapes according to your requirements or drawings.

Nickel Oxide MSDS File




Description

Nickel Oxide Sputtering Target Description

Nickel oxide sputtering target from Stanford Advanced Materials is an oxide sputtering material containing Ni and O.

Nickel

Nickel is a chemical element that originated from the shortened of the German ‘kupfernickel’ meaning either devil’s copper or St. Nicholas’s copper. It was first mentioned in 1751 and observed by F. Cronstedt. The isolation was later accomplished and announced by F. Cronstedt. “Ni” is the canonical chemical symbol of nickel. Its atomic number in the periodic table of elements is 28 with a location at Period 4 and Group 10, belonging to the d-block. The relative atomic mass of nickel is 58.6934(2) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Nickel Sputtering Target

OxygenOxygen is a chemical element that originated from the Greek ‘oxy’ and ‘genes’ meaning acid-forming. It was first mentioned in 1771 and observed by W. Scheele. The isolation was later accomplished and announced by W. Scheele. “O” is the canonical chemical symbol of oxygen. Its atomic number in the periodic table of elements is 8 with a location at Period 2 and Group 16, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Oxide Ceramic Sputtering Target

Nickel Oxide Sputtering Target Specification

Material Type Nickel Oxide
Symbol NiO
Color/Appearance Solid
Melting Point 1955 °C
Density 6.67 g/cm³
Type of Bond Indium bonding
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Nickel Oxide Sputtering Target Handling Notes

1. Indium Bonding is recommended for nickel oxide sputtering target. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services.

2. This material has a low thermal conductivity are susceptible to thermal shock.

Packaging

Our nickel oxide sputtering target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Get Contact

SAM’s nickel oxide sputtering targets are available in various forms, purities, sizes, and prices. We specialize in producing high purity film coating materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.

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Nickel Oxide Sputtering Target, NiO
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