|Purity||99.9%, 99.95%, 99.99%, 99.995%, 99.999%|
|Shape||Discs, Plates, Column Targets, Step Targets, Custom-made|
The Molybdenum Niobium Sputtering Target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers high-quality Molybdenum Niobium Sputtering Target at the most competitive prices.
Molybdenum Niobium Sputtering Target is a solid material used in a sputtering process to deposit thin films of molybdenum niobium onto a substrate. Sputtering is a technique in which atoms are ejected from the surface of a target material and then deposited onto a desired substrate to create a thin film.
Molybdenum Niobium Sputtering Target is typically made in the form of a disc or plate and is placed in a sputtering chamber. The chamber is then filled with an inert gas, such as argon, and a high voltage is applied to the target material. As a result, the gas ions are accelerated toward the target surface, causing atoms to be ejected and transferred to the substrate, forming a thin film.
|Appearance||Gray metallic target|
|Available Sizes||Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″
Molybdenum Niobium Sputtering Target allows for precise control of film thickness and uniformity, making it an essential tool in various thin film deposition applications, including optoelectronics, integrated circuits, solar cells, and magnetic recording media.
Our Molybdenum Niobium Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.
SAM’s Molybdenum Niobium Sputtering Targets are available in various forms, purities, and sizes. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.
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