ST0889 Aluminum Neodymium Sputtering Target, Al/Nd

Aluminum Neodymium Sputtering Target Description

The Aluminum Neodymium (Al/Nd) Sputtering Target from Stanford Advanced Materials is a specialized binary alloy target formulated for precise thin-film deposition. This Al/Nd target is engineered for applications requiring a controlled combination of aluminum and neodymium in the deposited film, often used in co-sputtering processes or to create composite thin films with tailored electrical, magnetic, and structural properties.

Key Advantages & Handling:

• Single-Target Deposition: Enables the creation of composite Al-Nd films from one source, simplifying process control.
• Enhanced Target Performance: The aluminum component can improve mechanical stability and thermal conductivity compared to pure neodymium targets.
• Critical Handling Note: Due to its material characteristics, indium bonding to a backing plate is strongly recommended for efficient heat dissipation and to prevent target damage during sputtering.

Aluminum Neodymium Sputtering Target Specifications

Aluminum Neodymium Sputtering Target Application

Aluminum Neodymium Sputtering Target plays a crucial role in the manufacturing of advanced electronic devices and facilitate the production of high-quality thin films with exceptional magnetic characteristics.

Aluminum Neodymium Sputtering Target Packaging

Our Aluminum Neodymium Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.

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SAM’s Aluminum Neodymium Sputtering Targets are available in various forms, purities, and sizes. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.