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ST11191 High-Purity Indium (In) Rotary Sputtering Target

High-Efficiency Indium Targets for Large-Area and Volume Coating

Material Indium (In)
Purity ≥ 99.99% (4N) Standard
Form Rotary Sputtering Target (Tubular)
Key Benefit High Uniformity & Material Utilization for Large Areas

Key Advantage: The rotary geometry ensures extremely uniform erosion, enabling consistent indium flux across large-area substrates—a critical factor for maintaining homogeneous film properties in display and PV manufacturing.
Customization: Purity (up to 99.999%), tube dimensions (OD, ID, Length), and bonding fully customizable.
Typical Applications: Large-area ITO co-sputtering for displays & touch panels, transparent conductive layers for flexible electronics, volume production of semiconductor contacts, and research on scalable indium film processes.




Description

Product Overview

Our Indium Rotary Sputtering Targets are engineered for productivity, combining the essential ultra-high purity of indium with the superior uniformity and material efficiency of a rotary design. This configuration is critical for cost-effective deposition of indium over large substrates, such as display panels or solar modules, particularly in processes like reactive co-sputtering for ITO.


Complete Technical Specifications

For detailed evaluation and procurement (Standard Reference: ST11191).

Parameter Specification / Typical Value
Material Indium (In)
Purity (Standard) ≥ 99.99% (4N)
Available Purity 99.99%, 99.995%, 99.999%
Density ≥ 7.28 g/cm³
Melting Point 156.6 °C
Electrical Resistivity ~8.4 µΩ·cm
Thermal Conductivity 82 W/(m·K)
Standard Shape Tubular (Seamless Construction)
Key Dimensions Custom OD, ID, Length
Sputtering Method DC Magnetron (Low-Power Optimized)
Cooling Requirement Critical – Requires efficient cathode cooling to prevent target melting/deformation.
Bonding/Integration Designed for secure mounting on cooled rotary mandrels.
Certification Certificate of Analysis (CoA) with GDMS/ICP-MS data provided

Technical & Application Notes

1. Enabling Large-Area ITO Deposition via Co-Sputtering
While ceramic ITO targets are common, reactive co-sputtering from separate In and Sn metal targets offers superior process control for tuning film composition and properties. For coating Gen 8+ display glass or large flexible webs, a rotary indium target is essential:

  • Uniformity at Scale: Provides a consistent In flux across meters of substrate, vital for uniform sheet resistance and transparency.
  • Material Efficiency: High utilization (>80%) of expensive indium metal.
  • Process Stability: The continuous rotation minimizes local heating and promotes stable, long-duration runs.

2. The Critical Importance of Thermal Management
Indium’s low melting point (156.6°C) presents a unique engineering challenge for rotary targets, which operate under high plasma power. Our design and manufacturing process prioritizes:

  • Robust Bonding/Cooling: Targets are engineered for intimate thermal contact with a high-efficiency water-cooled mandrel.
  • Controlled Power Density: Process guidelines are provided to ensure operation below the thermal limits of the material.
  • Material Integrity: We use high-purity, vacuum-cast indium with controlled grain structure to minimize internal stress and risk of deformation.

3. Application-Specific Guidance

  • Flat Panel Display (FPD) Manufacturing: Primary application. Used in multi-cathode systems for reactive co-sputtering of ITO on TFT-LCD, OLED, and touch panel substrates.
  • Flexible & Printed Electronics: For depositing conductive indium or indium oxide layers on temperature-sensitive polymer webs in roll-to-roll coaters.
  • Photovoltaics: For depositing back contacts or transparent layers in some thin-film solar cell architectures (e.g., CIGS).
  • Volume Semiconductor Processing: For applications requiring uniform indium contact layers across entire wafers.

Quality Assurance

Beyond standard purity analysis via GDMS/ICP-MS, we perform rigorous ultrasonic inspection to ensure the integrity of the tubular structure and its bond to any backing interface (if pre-bonded). Dimensional verification (concentricity, straightness, wall thickness uniformity) is critical to prevent vibration and ensure even cooling. We guarantee the target meets the mechanical and thermal specifications required for reliable integration into industrial rotary cathodes.


Why Stanford Advanced Materials (SAM)

  • Expertise in Low-Melting-Point Metals: We have specialized knowledge in handling and engineering targets from challenging materials like indium.
  • Supplier to the Display Industry: We understand the stringent uniformity and productivity requirements of FPD manufacturers.
  • Full Technical Partnership: We provide comprehensive support on target specifications, cooling parameters, and safe operating windows for indium sputtering.

Request More Information

Get a Formal Quote or Technical Consultation
Indium rotary targets require careful system matching. For a precise quote and technical review, please provide:

  1. Your rotary cathode manufacturer/model and cooling capacity.
  2. Required target dimensions (OD, ID, Length) and purity.
  3. Substrate type and size (e.g., Gen 8.5 glass, 300mm wafer, flexible web).