ST11177 High-Purity Cobalt (Co) Rotary Sputtering Target

Complete Technical Specifications

For detailed evaluation and procurement (Standard Reference: ST11177).

Technical & Application Notes

1. The Productivity Advantage of Rotary Design

The cylindrical geometry of a rotary target distributes heat and plasma bombardment over a much larger, continuously rotating surface area compared to a static planar target. This leads to:

• Material Utilization >80%: Dramatically reduces material waste and cost-per-deposited-film.
• Reduced “Racetrack” Erosion: Promotes even wear, maintaining consistent deposition rates and film properties over the entire target life.
• Enhanced Thermal Management: Continuous rotation and larger thermal mass improve heat dissipation, allowing for higher power operation and reduced risk of target cracking or debonding.

2. Precision Engineering for Industrial Reliability

A rotary target is a dynamic component requiring high precision. Our manufacturing ensures:

• Excellent Concentricity & Straightness: Critical for uniform magnetic field coupling and vibration-free rotation at high speeds.
• Uniform Wall Thickness: Ensures consistent thermal and electrical characteristics around the entire circumference.
• High-Density, Fine-Grained Structure: Guarantees low particulate generation and stable sputtering performance in demanding industrial environments.

3. Application-Specific Guidance

• Magnetic Media & Data Storage: The standard for high-volume production of hard disk drive platters, where uniform magnetic film properties across large substrates are essential for yield and performance.
• Industrial Hard Coatings: Used in large-scale PVD systems to apply wear-resistant cobalt or cobalt alloy coatings (e.g., Stellite-type) on industrial tools, turbine blades, and wear parts.
• Roll-to-Roll & Flexible Electronics: Ideal for depositing conductive or functional cobalt-based layers on flexible polymer webs in a continuous, high-throughput process.
• Semiconductor Advanced Packaging: For high-volume deposition of barrier/seed layers in fan-out wafer-level packaging (FOWLP) or other panel-level processing.

Quality Assurance

Each cobalt rotary target undergoes rigorous inspection, including ultrasonic testing for internal integrity, precise dimensional verification (OD, ID, wall thickness, straightness), and microstructural analysis. We ensure the target meets the mechanical and material specifications required for reliable, trouble-free integration into high-performance rotary cathode systems.

Why Stanford Advanced Materials (SAM)

• Industrial Coating Expertise: We understand the throughput and reliability demands of large-area and high-volume coating production.
• Rotary Target Specialization: We master the metallurgy and precision engineering required to produce high-performance tubular targets.
• Full Technical Support: We provide guidance on target specifications, cooling parameters, and optimal sputtering modes for rotary systems.

Request More Information

Get a Formal Quote or CoA Sample

To specify the optimal cobalt target for your application, please provide:

1. Required purity grade (e.g., 99.99%, 99.995%).
2. Target dimensions (Thickness x Length x Width) or a drawing.
3. Primary application (e.g., semiconductor barrier layer, magnetic film deposition).