Engineered for superior performance in DC magnetron sputtering systems, our high-purity Silver Planar Targets deliver exceptional film uniformity and process stability, making them ideal for applications demanding the highest electrical and thermal conductivity.
| Material | Silver (Ag) |
| Purity | ≥ 99.99% (4N) |
| Form | Planar Sputtering Target |
| Shape | Rectangular (Standard) |
Key Advantage: Ultra-high purity and controlled grain structure for low-particle, uniform deposition of highly conductive silver films.
Customization: Thickness, length, width, and bonding tailored to your chamber and process requirements.
Typical Applications: Semiconductor interconnects & electrodes, high-reflectivity optical coatings, flexible electronics, and EMI shielding.
For detailed evaluation and procurement (Standard Reference: ST11165).
| Parameter | Specification / Typical Value | Notes / Process Relevance |
|---|---|---|
| Material | Silver (Ag) | — |
| Purity (Standard) | ≥ 99.99% (4N) | Trace metal impurities are minimized for optimal film conductivity and stability. |
| Density | ≥ 10.4 g/cm³ (Theoretical: 10.5 g/cm³) | High density ensures consistent thermal conductivity and sputter rate. |
| Grain Structure | Fine, Uniform | Controlled to minimize arcing and particulate generation. |
| Standard Shape | Rectangular | Other shapes (circular, custom geometries) available. |
| Standard Thickness | ≥ 1 mm | Thickness can be customized based on power and life requirements. |
| Thermal Conductivity | ~430 W/(m·K) | Excellent heat dissipation for stable high-power sputtering. |
| Electrical Resistivity | ~1.59 µΩ·cm @ 20°C | Key property for predicting film performance. |
| Melting Point | 961.8 °C | — |
| Coeff. of Thermal Expansion | ~18.9 x 10⁻⁶ /K | Important for bonding compatibility and thermal stress management. |
| Sputtering Method | DC (Recommended), RF compatible | — |
| Bonding Options | Indium, Epoxy, or specialty alloys to Cu/SS backing plate | Ensures optimal heat transfer and mechanical integrity. |
| Certification | Certificate of Analysis (CoA) provided | Verifies purity and key physical properties. |
1. Purity & Film Performance
Our ≥99.99% purity standard is critical for achieving the lowest possible resistivity and highest reflectivity in deposited silver films. Even minor impurities can significantly increase film resistivity, degrade optical performance, or affect long-term environmental stability. Our CoA provides traceable impurity data to support your process qualification.
2. Optimized for High-Power Sputtering
Silver’s exceptionally high thermal conductivity (~430 W/m·K) allows for efficient heat dissipation from the target surface. Our targets are manufactured to achieve high density and a uniform, fine-grain microstructure, which together enable stable operation at higher power densities, increasing deposition rates without compromising film quality or target life.
3. Application-Specific Guidance
Every Silver Planar Target undergoes rigorous inspection, including dimensional verification via laser scanning, surface finish analysis, and microstructural examination (SEM). The final product is cleaned and packaged in a cleanroom environment to ensure it arrives contamination-free and ready for installation.
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