| Chemical Formula | CuZnTe |
| Catalog No. | ST0923 |
| CAS Number | N/A |
| Purity | 99.9%, 99.95%, 99.99%, 99.995%, 99.999% |
| Shape | Discs, Plates, Column Targets, Step Targets, Custom-made |
The Copper Zinc Telluride Sputtering Target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers Copper Zinc Telluride Sputtering Targets renowned for exceptional quality, all at highly competitive prices.
Copper Zinc Telluride Sputtering Target is a specialized material used in the sputter deposition process. Sputter deposition is a widely used technique in producing thin films for various applications in electronics and optoelectronics.
The sputter deposition process involves bombarding the target material (Copper Zinc Telluride Sputtering Target) with high-energy ions in a vacuum chamber. This causes atoms or particles from the target material to be ejected, and these ejected particles then deposit onto a substrate, forming a thin film.
Related Product: CIGS Copper Indium Gallium Selenide Sputtering Target
| Compound Formula | CuZnTe |
| Molecular Weight | N/A |
| Appearance | Gray target |
| Melting Point | N/A |
| Density (g/cm3) | N/A |
| Available Sizes | Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Copper Zinc Telluride Sputtering Target is widely used in various applications in Photovoltaic, Thermoelectric, and Optoelectronic Devices.
Our Copper Zinc Telluride Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.
SAM’s Copper Zinc Telluride Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) display and optical applications.
Submit your review | |
