ST0889 Aluminum Neodymium Sputtering Target, Al/Nd

Aluminum Neodymium Sputtering Target Description

Aluminum Neodymium Sputtering Target is a specialized material that is utilized in the process of sputtering. Sputtering is a technique used in the field of thin film deposition, where a thin film of a specific material is deposited onto a substrate.

These sputtering targets are typically used in the production of thin films for electronic devices, such as solar cells, magnetic storage devices, and semiconductors. The sputtering process involves bombarding the target material with high-energy ions, which causes atoms to be dislodged from the target surface. These atoms then travel and condense onto the substrate, forming a thin film.

Aluminum Neodymium Sputtering Target Specifications

Aluminum Neodymium Sputtering Target Handling Notes

1. Indium bonding is recommended for Aluminum Neodymium Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
2. This material has a low thermal conductivity, and is susceptible to thermal shock.

Aluminum Neodymium Sputtering Target Application

Aluminum Neodymium Sputtering Target plays a crucial role in the manufacturing of advanced electronic devices and facilitate the production of high-quality thin films with exceptional magnetic characteristics.

Aluminum Neodymium Sputtering Target Packaging

Our Aluminum Neodymium Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.

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SAM’s Aluminum Neodymium Sputtering Targets are available in various forms, purities, and sizes. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.