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Types and Applications of Sputtering Targets in the Electronic Industry

sputtering target for electronics

Sputtering targets have important applications in many areas, such as architecture, optics, electronics and so on. Sputtering targets used in electronic industry can be subdivided into semiconductor target (also called anelva target), planar target, coated glass target, solar photovoltaic target, and so on. There are some differences in the selection and performance requirements of sputtering materials in different application fields. Among them, anelva targets, the sputtering targets used in semiconductor integrated circuits, are the most demanding and strict.

The table below shows the main types, uses, and performance requirements for sputtering targets in the electronics field. If it helps you, please share this article with your friends.

Type Application Main Variety Performance Requirements
Semiconductor Used to prepare integrated circuit core materials W, WTi, Ti, Ta, Al alloy with purity 4N or 5N. Highest technical requirements; ultra-high purity metal; high precision size; high integration
Flat display Sputtering technology guarantees uniformity of film produced, increases productivity and reduces costs Nb, Si, Cr, Mo, MoNb, Al alloy , Cu and Cu alloy targets High technical requirements; high purity materials; large material area; high uniformity
Decoration Used for coating the surface of the product for beautification, wear resistance and corrosion resistance. Cr, Ti, Zr, Ni, W, TiAl, CrSi, CrTi, CrAlZr target General technical requirements; mainly used for decoration, energy-saving, etc.
Tool Enhance the surface of tools and molds, improve the life and the quality of the parts manufactured TiAl, CrAl, Cr, Ti, TiC, Al2O3 target High-performance requirements; extended service life
Solar Sputter coating technology for the production of fourth-generation thin-film solar cells ZnOAl, ZnO, ZnAl, Mo, CdS, CIGS target High technical requirements; large application range
Electron device Thin-film resistors, film capacitors NiCr, NiCrSi, CrSi, Ta, NiCrAl target Requires small size, good stability, and low-temperature coefficient of resistance
Information storage Used to make storage Cr alloy, Co alloy, CoFe alloy, Ni alloy High storage density; high transmission speed
About the author

Julissa Green graduated from the University of Texas studying applied chemistry. She started her journalism life as a chemistry specialist in Stanford Advanced Materials (SAM) since 2016 and she has been fascinated by this fast growing industry ever since. If you have any particular topics of interest, or you have any questions, you can reach her at julissa@samaterials.com.

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About Us

Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. It was first established in 1994 to begin supplying high-quality rare-earth products to assist our customers in the research and development (R&D) fields.

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