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(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0039 Ruthenium Sputtering Target, Ru

Chemical Formula: Ru
Catalog Number: ST0039
CAS Number: 7440-18-8
Purity: 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Ruthenium sputtering target is available in various forms, purities, sizes, and prices. We’re capable of supplying custom sputtering materials per any specs/drawings you provide with us.




Description

Ruthenium Sputtering Target Description

Ruthenium Ruthenium sputtering target is a gray target composed of high purity ruthenium metal. Ruthenium is a chemical element that originated from Russia (with the Latin name Ruthenia). It was first mentioned in 1807 and observed by J. Sniadecki. The isolation was later accomplished and announced by J. Sniadecki. “Ru” is the canonical chemical symbol of ruthenium. Its atomic number in the periodic table of elements is 44 with the location at Period 5 and Group 8, belonging to the d-block. The relative atomic mass of ruthenium is 101.07(2) Dalton, the number in the brackets indicating the uncertainty.

Ruthenium Sputtering Target Specification

Material Type Ruthenium
Symbol Ru
Color/Appearance Gray
Melting Point 2334 °C
Density 12370 kg/m3
Thermal Conductivity 1.17 W·m-1·K-1 (25°C)
Thermal Expansion 6.4 µm/(m·K) (25°C)
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.

Ruthenium Sputtering Target Bonding Services

Indium Bonding is available for ruthenium sputter targets. Stanford Advanced Materials (SAM) is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.

Target Bonding Services

Ruthenium Sputtering Target Application

The ruthenium sputtering target is used to produce thin films of pure ruthenium on substrates, which shows promising properties for use in microchips.

Other applications of ruthenium are:

  • Used in the electronic industry for manufacturing electrical contacts and chip resistors
  • Used as anodes for chlorine production in electrochemical cells in the chemical industry.
  • Used as a hardener for platinum and palladium and versatile catalyst in removing H2S from oil refineries and other industrial processes.

Ruthenium Sputtering Target Packaging

Our ruthenium sputter targets are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.

Get Contact

SAM’s ruthenium sputtering targets are available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film deposition materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Please send us an inquiry for the current prices of the sputtering targets and other deposition materials that are not listed.

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Ruthenium Sputtering Target, Ru
Average rating:  
 1 reviews
by Scott Lowe on Ruthenium Sputtering Target, Ru

Bought these and donated them to the local Community College chemistry lab.

Hope they be happy when they are to receive these gift.