Tantalum (Ta) Sputtering Target

Target Bonding of Tantalum Sputtering Target

Indium Bonding and Elastomeric Target Bonding Service are available for Tantalum Sputtering Target. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.

Specification of Tantalum Sputtering Target

Available Sizes of Tantalum Sputtering Target

We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.

Description of Tantalum Sputtering Target

Tantalum is a chemical element originated from King Tantalus, father of Niobe from Greek mythology. It was first mentioned in 1802 and observed by G. Ekeberg. “Ta” is the canonical chemical symbol of tantalum. Its atomic number in the periodic table of elements is 73 with location at Period 6 and Group 5, belonging to the d-block. The relative atomic mass of tantalum is 180.94788(2) Dalton, the number in the brackets indicating the uncertainty.

Tantalum sputtering target is used in integrated circuits and Thin Film Transistor Liquid Crystal Display (TFT-LCD). SAM specializes in producing high purity Aluminum Sputtering Targets with the highest possible density and smallest possible average grain sizes.

Packaging

Our tantalum sputter targets are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.

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We specialize in producing high purity tantalum sputter targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.  Get an inquiry right now.