Blog | Stanford Advanced Materials

Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. We update every week about news and knowledge of sputtering targets and evaporation materials. Here are the blogs we published previously.

September 23, 2019Blog, Case Study, Sputtering Technology, Targets Industry News

Effect of Silver Additives on the Conductivity of Indium Tin Oxide Sputtered Films

Transparent conductive films have many applications, and indium tin oxide films have received great attention in the glass manufacturing industry due to their excellent properties. However, the manufacturing process of the indium tin oxide film requires a higher temperature, which limits its application. In order to reduce this temperature, various “sintering agents” have been taken...

September 19, 2019Blog, Most Popular, PVD, Target Application

Table Comparison: Physical Vapor Deposition Vs. Chemical Vapor Deposition

Physical vapor deposition (PVD) and chemical vapor deposition (CVD) are considered to be the most attractive surface coating technologies and have a wide range of applications in various industries. Let us compare these two methods in detail. Physical Vapor Deposition Chemical Vapor Deposition Definition Physical vapor deposition (PVD) is a series of vacuum deposition methods...

September 15, 2019Blog, Most Popular, Sputtering Target, Target Application

Platinum vs. Gold: Which Material Is Better for Rings?

As for the two most commonly used metals for engagement and wedding rings, platinum and gold, most people distinguish them by their different colors-platinum is naturally white, and gold is naturally yellow. However, rings made of white gold (composed of gold, alloys, and a rhodium plating) have a similar white color to platinum rings. Since...

August 27, 2019Blog, Cornerstone, Sputtering Target

An Overview of Tantalum Element

Tantalum Overview The texture of the tantalum is very hard and the hardness can reach 6-6.5. Its melting point is as high as 2996 °C, only after carbon, tungsten, rhenium, and osmium. Tantalum is malleable and can be drawn into a thin foil. Its coefficient of thermal expansion is very small, and it only expands by 6.6 parts...

August 27, 2019Blog, PVD, Sputtering Target, Sputtering Technology

Sputter Coating Technologies: Direct Current Sputtering (DC Sputtering)

We have previously made a brief introduction of Five Sputter Coating Technologies, including unbalanced magnetron sputtering, radio frequency sputtering (RF sputtering), direct current magnetron sputtering (DC sputtering), mid-frequency alternating current magnetron sputtering (AC sputtering), and reactive magnetron sputtering. In this article, we are going to talk about direct current (DC) sputtering in detail. To begin...

August 22, 2019Blog, Sputtering Target, Target Application

Types and Applications of Sputtering Targets in the Electronic Industry

Sputtering targets have important applications in many areas, such as architecture, optics, electronics and so on. Sputtering targets used in electronic industry can be subdivided into semiconductor target (also called anelva target), planar target, coated glass target, solar photovoltaic target, and so on. There are some differences in the selection and performance requirements of sputtering materials in different application fields....

August 15, 2019Blog, Most Popular, Target Application

How is the Semiconductor Wafer Manufactured? (With Infographic)

Semiconductor wafers are the basic material for manufacturing electronic chips. The most important raw material for semiconductor integrated circuits is silicon, which is widely found in rocks and gravels in the form of silicates or silica in nature. The fabrication process of the semiconductor silicon wafer can be divided into three basic steps: silicon purification...

July 31, 2019Blog, Most Popular, Sputtering Target, Target Application

What Are the Applications of Sputtering Targets? (With Video)

Sputtering targets are a physical vapor deposition (PVD) mechanism with many uses in modern technology and manufacturing. In the sputtering process, the atoms are pulled from the sputter target with powerful magnets, and a controlled gas (usually argon) is introduced. Then, the processed to collide with each other in their gaseous state before condensing into...

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